MCF5232 ETC, MCF5232 Datasheet - Page 12

• Manufacturer Part Number: MCF5232
• Description: Integrated Microprocessor Hardware Specification
• Manufacturer: ETC

DACK[2:0] and DREQ[2:0] do not have a dedicated bond pads.
TSIZ0 and DT0OUT for DACK0, IRQ2 and DT2IN for DREQ2,
eTPU/EthENB
Signal Descriptions
12
Signal Name
TS and DT2OUT for DACK2, TSIZ1and DT1OUT for DACK1,
TEA and DT1IN for DREQ1, and TIP and DT0IN for DREQ0.
QSPI_DOUT
QSPI_CS1
QSPI_CS0
QSPI_CLK
ERXD[3:0]
ETXD[3:0]
QSPI_DIN
I2C_SDA
ERXCLK
I2C_SCL
ETXCLK
ERXER
ERXDV
ETXEN
ETXER
U2TXD
U2RXD
U1CTS
EMDC
ECRS
ECOL
Please refer to the following pins for muxing:
PFECI2C3
PFECI2C1
PFECI2C0
PUARTH1
PUARTH0
PUARTL7
PQSPI4
PQSPI3
PQSPI2
PQSPI1
PQSPI0
GPIO
—
—
—
—
—
—
—
—
—
—
—
MCF523x Integrated Microprocessor Hardware Specification, Rev. 1.3
Table 2. MCF523x Signal Information and Muxing (continued)
Alternate 1 Alternate 2 Dir.
I2C_SDA
I2C_SCL
CAN0RX
SD_CKE
I2C_SCL
CAN1RX
CAN0TX
CAN1TX
U2CTS
—
—
—
—
—
—
—
—
—
—
—
—
—
U2TXD
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Feature Control
Preliminary
I/O
I/O
O
O
O
O
O
O
O
O
O
I
I
I
I
I
I
I
I
I
I
I
UARTs
1
DMA
QSPI
I
2
C
MCF5232
QFP
160
147
148
149
150
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
MAPBGA
MCF5232
196
J12
J11
C5
B7
A6
B5
A5
A8
A7
B8
—
—
—
—
—
—
—
—
—
—
—
—
—
MAPBGA
MCF5233
B10
D11
D10
C11
256
L15
L14
D9
C8
D8
B8
—
—
—
—
—
—
—
—
—
—
—
—
—
Freescale Semiconductor
D3, D4, C3,
B6, B5, A5,
MCF5234
MAPBGA
B10
D11
D10
C11
256
L15
L14
D7
E3
E4
C4
D5
C5
D6
C6
B7
D9
B8
C8
D8
F3
F4
—
—
D3, D4, C3,
B6, B5, A5,
MAPBGA
MCF5235
D11
D10
C11
256
L15
L14
B10
D7
C4
D5
C5
D6
C6
M4
D9
C8
D8
F3
F4
E3
E4
B7
B8
—