SLE66CX182PE Infineon Technologies AG, SLE66CX182PE Datasheet - Page 4
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SLE66CX182PE
Manufacturer Part Number
SLE66CX182PE
Description
Security & Chip Card ICs
Manufacturer
Infineon Technologies AG
Datasheet
1.SLE66CX182PE.pdf
(9 pages)
New
New
New
Memory Management and Protection Unit
Security Features
Memory Security
Testmode
Preliminary - Short Product Information
Irreversible Lock - Out of test-mode
Addressable memory of up to 16 Mbyte
Separates OS (system mode) and application (user
mode)
System routines called by interrupts
OS can restrict access to peripherals in application
mode
Variable application orientated segments defined
and controlled by OS
Code execution from XRAM possible
Enhanced multi-application support by 16
descriptors for system application mode.
Enhanced sensor concept:
Bus confusion
Security reset detection
Current control oscillator
Sparkling SFR encryption for DDES and ACE, CRC
module and RNG
32 bytes security PROM, hardware protected for
batch-, wafer-, die- individual security data. Unique
chip identification number for each chip
Additional memory for customer-defined security
FabKey on request
MED – memory encryption/decryption device for
XRAM, ROM and EEPROM
Security optimized layout and layout scrambling
Fast IRAM erase
Enhanced Error correction unit (ECU)
Low and high voltage sensors
Frequency sensors and filters
Light Sensor
Glitch Sensors
Temperature Sensor
Life Test Function for Sensors (UMSLC)
4 / 9
Anti Snooping
Targeted Certifications
Support
Supported Standards
Document References
Development Tools Overview
HW-& SW-Tools (Emulator, ROM Monitor, Card
Emulator, Simulator, Softmasking)
Application notes
Automatic randomization smoothing of power profile
Effective HW-countermeasures against SEMA/DEMA,
SPA/DPA, DFA and Timing-Attacks
Non standard dedicated Smart Card CPU – Core
Active Shield with automatic and user controlled attack
detection
Hardware countermeasures controlled by True
Random Number Generator
CC EAL5+
VISA level 3
CAST
ISO/IEC 7816
EMV 2000
GSM 11.11, 11.12, 11.18
ETSI TS 102 221
Confidential Data Book SLE 66CxxxPE
Qualification report
Chip delivery specification for wafer with chip-layout
(die size, orientation,...)
Module
package, etc.
Qualification report module
Short Product Information Software Development Kit
SDK CC
Short Product Information Card Emulator CE66P
Short Product Information ROM Monitor RM66P
Short Product Information Emulator ET66P Hitex or
ET66P KSC
Short Product Information Smart Mask Package
specification
SLE 66CX182PE
containing
description
02.04
of