SCAN18373TSSCX Fairchild Semiconductor, SCAN18373TSSCX Datasheet
SCAN18373TSSCX
Specifications of SCAN18373TSSCX
Related parts for SCAN18373TSSCX
SCAN18373TSSCX Summary of contents
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... JM-2000LB in January 2009. Replace non-green by green (Halogen-free Flame Retardant) mold compound is to align with the Green Initiative by Fairchild Semiconductor and is dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level interconnect lead-free and RoHS compliance.The reference material changes have been made to provide a 'full green' package ...
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... All reliability tests outlined in Q20070484 qualification plan were successfully completed with no failure detected and meet the requirements for release. As such, SSOP-48 & -56 lead packages manufacture in Fairchild Semiconductor Malaysia are qualified to be assembled with die-attach epoxy CRM-1064L and green mold compound EME-G630M. ...
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Q20070484CAGATE+ GTLP18T612MEA Q20070484CBGATE+ GTLP18T612MEA Test: (High Temperature Storage Life) Lot Device Q20070484AAHTSL 74LVTH16501MEA Q20070484ABHTSL Q20070484BAHTSL 74ABT16543CSSC Q20070484BBHTSL Q20070484CAHTSL GTLP18T612MEA Q20070484CBHTSL Test: (Static Op Life) Lot Device Q20070484AASOPL1 74LVTH16501MEA Q20070484ABSOPL1 Q20070484BASOPL1 74ABT16543CSSC Q20070484BBSOPL1 Q20070484CASOPL1 GTLP18T612MEA Q20070484CBSOPL1 Test: -65C, 150C (Temperature Cycle) ...
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... GTLP16612MEA GTLP18T612MEA SCAN18373TSSCX SCAN18540TSSC Pg. 4 ...
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SCAN18541TSSCX SCAN18541TSSC Pg. 5 ...