SSTUH32866EC/G,551 NXP Semiconductors, SSTUH32866EC/G,551 Datasheet - Page 2

• Manufacturer Part Number: SSTUH32866EC/G,551
• Description: IC BUFFER 1.8V 25BIT SOT536-1
• Manufacturer: NXP Semiconductors

Specifications of SSTUH32866EC/G,551

• Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 1.9 V
• Number Of Bits: 25, 14
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935277966551; SSTUH32866EC/G-S; SSTUH32866EC/G-S

Philips Semiconductors
3. Applications
4. Ordering information
Table 1:
T
9397 750 14199
Product data sheet
Type number
SSTUH32866EC/G
SSTUH32866EC
amb
= 0 C to +70 C.
Ordering information
Solder process
Pb-free (SnAgCu
solder ball compound)
SnPb solder ball
compound
Supports LVCMOS switching levels on the control and RESET inputs
Single 1.8 V supply operation
Available in 96-ball, 13.5 mm
DDR2 registered DIMMs desiring parity checking functionality
Stacked or planar high-DRAM count registered DIMMs
Package
Name
LFBGA96
LFBGA96
1.8 V high-drive DDR2 configurable registered buffer with parity
Rev. 01 — 13 May 2005
Description
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
5.5 mm, 0.8 mm ball pitch LFBGA package
5.5
5.5
1.05 mm
1.05 mm
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SSTUH32866
Version
SOT536-1
SOT536-1
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