SSTUH32866EC/G,551 NXP Semiconductors, SSTUH32866EC/G,551 Datasheet - Page 28

• Manufacturer Part Number: SSTUH32866EC/G,551
• Description: IC BUFFER 1.8V 25BIT SOT536-1
• Manufacturer: NXP Semiconductors

Specifications of SSTUH32866EC/G,551

• Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 1.9 V
• Number Of Bits: 25, 14
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935277966551; SSTUH32866EC/G-S; SSTUH32866EC/G-S

Philips Semiconductors
21. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
8
9
10
10.1
11
11.1
11.2
11.3
11.4
12
13
13.1
13.2
13.3
13.4
13.5
14
15
16
17
18
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Recommended operating conditions. . . . . . . 11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 27
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Contact information . . . . . . . . . . . . . . . . . . . . 27
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
Function table . . . . . . . . . . . . . . . . . . . . . . . . . 10
Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 14
Parameter measurement information for data
output load circuit . . . . . . . . . . . . . . . . . . . . . . 17
Data output slew rate measurement
information . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Error output load circuit and voltage
measurement information . . . . . . . . . . . . . . . . 20
Partial parity out load circuit and voltage
measurement information . . . . . . . . . . . . . . . . 21
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 24
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 25
Package related soldering information . . . . . . 25
1.8 V high-drive DDR2 configurable registered buffer with parity
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Published in The Netherlands
SSTUH32866
Document number: 9397 750 14199
Date of release: 13 May 2005