SSTV16859MTDX Fairchild Semiconductor, SSTV16859MTDX Datasheet

SSTV16859MTDX

Manufacturer Part Number

SSTV16859MTDX

Description

IC REG 13BIT DUAL SSTL-2 64TSSOP

Manufacturer

Fairchild Semiconductor

Series

74SSTVr

Datasheet

1.SSTV16859G.pdf (8 pages)

Specifications of SSTV16859MTDX

Logic Type

Supply Voltage

2.3 V ~ 2.7 V

Number Of Bits

Operating Temperature

0°C ~ 70°C

Mounting Type

Surface Mount

Package / Case

64-TSSOP

Logic Family

SSTV

Logical Function

Registered Buffer

Number Of Elements

Number Of Inputs

Number Of Outputs

High Level Output Current

-20mA

Low Level Output Current

20mA

Package Type

TSSOP W

Propagation Delay Time

5ns

Operating Supply Voltage (typ)

2.5V

Operating Supply Voltage (max)

2.7V

Operating Supply Voltage (min)

2.3V

Output Type

Standard

Clock-edge Trigger Type

Posit/Negat-Edge

Polarity

Non-Inverting

Technology

CMOS

Frequency (max)

200(Min)MHz

Mounting

Surface Mount

Pin Count

Operating Temp Range

0C to 70C

Operating Temperature Classification

Commercial

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence. This is a preliminary

notification. A Final PCN will be issued when qualification is complete and data is available.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Chiah, BoonHwa

E-mail: BoonHwa.Chiah@fairchildsemi.com

Phone: 8502357

Implementation of change:

Expected 1st Device Shipment Date: 2008/04/28

Earliest Year/Work Week of Changed Product: 0824

Change Type Description: Mold Compound

Description of Change (From): TSSOP package assembly at all FSC approved manufacturing

locations using non Green mold compound as shown in table 1.

Description of Change (To): TSSOP package assembly at all FSC approved manufacturing

locations using Green mold compound as shown in table 2.

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance. The referenced material changes have been made

to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at :

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070049

Qualification :

To qualify Sumitomo G700K green mold compound as a replacement for Sumitomo

EME 6730B and EME 7050 type B at Amkor for assembly of TSSOP packages for the

system Power and Logic product families.

Technical Contact:

Name: Yeoh, LiangChoon

E-mail: Liang.Yeoh@fairchildsemi.com

Phone: 8502744

FORECAST CHANGE NOTIFICATION

Date Issued On : 2007/11/30

Date Created : 2007/11/28

PCN# : Q4074806

Pg. 1

Related parts for SSTV16859MTDX

SSTV16859MTDX Summary of contents

Page 1

... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...

Page 2

Change From Change To Qualification Stress Test and Sample Size Detail Device #1 FAN1655MTFX Package: NMTF0 #Leads: 016 Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard DOPL JESD22-A108 125C, 0V HAST2 X JESD22-A110 85%RH, 110C, ...

Page 3

... AEC-Q100-006 155C, 400V GATE- AEC-Q100-006 155C, -400V HTSL X JESD22-A103 150C SOPL1 X JESD22-A108 150C, 0V THBT X JESD22-A101 85%RH, 85C, 0V 168 TMCL1 X JESD22-A104 -65C, 150C Device #4 SSTV16859MTDX Package: NMTD0 #Leads: 064 Precondition Description: Stress P/C Standard PCNL3A JESD22-A113 Environment Stress Detail: Stress P/C Standard ...

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