NAND04GW3B2DN6E NUMONYX, NAND04GW3B2DN6E Datasheet - Page 17

IC FLASH 4GBIT 48TSOP

NAND04GW3B2DN6E

Manufacturer Part Number
NAND04GW3B2DN6E
Description
IC FLASH 4GBIT 48TSOP
Manufacturer
NUMONYX
Datasheet

Specifications of NAND04GW3B2DN6E

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
4G (512M x 8)
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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NAND04G-B2D, NAND08G-BxC
3.7
3.8
3.9
3.10
3.11
Write enable (W)
The Write Enable input, W, controls writing to the command interface, input address and
data latches. Both addresses and data are latched on the rising edge of Write Enable.
During power-up and power-down a recovery time of 10 µs (min) is required before the
command interface is ready to accept a command. It is recommended to keep Write Enable
High during the recovery time.
Write protect (WP)
The Write Protect pin is an input that gives a hardware protection against unwanted program
or erase operations. When Write Protect is Low, V
program or erase operations.
It is recommended to keep the Write Protect pin Low, V
Ready/Busy (RB)
The Ready/Busy output, RB, is an open-drain output that identifies if the P/E/R controller is
currently active.
When Ready/Busy is Low, V
operation completes, Ready/Busy goes High, V
The use of an open-drain output allows the ready/busy pins from several memories to be
connected to a single pull-up resistor. A Low then indicates that one or more of the
memories is busy.
During power-up and power-down a minimum recovery time of 10 µs is required before the
command interface is ready to accept a command. During this period the RB signal is Low,
V
Refer to
calculate the value of the pull-up resistor.
V
V
power supply for all operations (read, program and erase).
An internal voltage detector disables all functions whenever V
Table
Each device in a system should have V
widths should be sufficient to carry the required program and erase currents.
V
Ground, V
ground.
OL
DD
DD
SS
.
provides the power supply to the internal core of the memory device. It is the main
29) to protect the device from any involuntary program/erase during power-transitions.
ground
supply voltage
Section 12.1: Ready/busy signal electrical characteristics
SS,
is the reference for the power supply. It must be connected to the system
OL
, a read, program or erase operation is in progress. When the
DD
decoupled with a 0.1 µF capacitor. The PCB track
OH
IL
.
, the device does not accept any
IL
, during power-up and power-down.
DD
is below V
for details on how to
Signals description
LKO
(see
17/72

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