CY7C1512AV18-200BZXC Cypress Semiconductor Corp, CY7C1512AV18-200BZXC Datasheet

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CY7C1512AV18-200BZXC

Manufacturer Part Number
CY7C1512AV18-200BZXC
Description
IC SRAM 72MBIT 200MHZ 165TFBGA
Manufacturer
Cypress Semiconductor Corp

Specifications of CY7C1512AV18-200BZXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous, QDR II
Memory Size
72M (4M x 18)
Speed
200MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
165-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1512AV18-200BZXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1512AV18-200BZXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Cypress Semiconductor Corporation
Document #: 38-05565 Rev. *E
Features
Configurations
CY7C1517V18 – 8M x 8
CY7C1528V18 – 8M x 9
CY7C1519V18 – 4M x 18
CY7C1521V18 – 2M x 36
Selection Guide
Maximum Operating Frequency
Maximum Operating Current
• 72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)
• 300-MHz clock for high bandwidth
• 4-Word burst for reducing address bus frequency
• Double Data Rate (DDR) interfaces
• Two input clocks (K and K) for precise DDR timing
• Two input clocks for output data (C and C) to minimize
• Echo clocks (CQ and CQ) simplify data capture in
• Synchronous internally self-timed writes
• 1.8V core power supply with HSTL inputs and outputs
• Variable drive HSTL output buffers
• Expanded HSTL output voltage (1.4V–V
• Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
• Offered in lead-free and non lead-free packages
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement
(data transferred at 600 MHz) @ 300 MHz
— SRAM uses rising edges only
clock-skew and flight-time mismatches
high-speed systems
300 MHz
300
950
DD
)
198 Champion Court
72-Mbit DDR-II SRAM 4-Word Burst
278 MHz
278
900
Functional Description
The CY7C1517V18, CY7C1528V18, CY7C1519V18 and
CY7C1521V18 are 1.8V Synchronous Pipelined SRAM
equipped with DDR-II (Double Data Rate) architecture. The
DDR-II consists of an SRAM core with advanced synchronous
peripheral circuitry and a two-bit burst counter. Addresses for
Read and Write are latched on alternate rising edges of the
input (K) clock. Write data is registered on the rising edges of
both K and K. Read data is driven on the rising edges of C and
C if provided, or on the rising edge of K and K if C/C are not
provided. Each address location is associated with four 8-bit
words in the case of CY7C1517V18 and four 9-bit words in the
case of CY7C1528V18 that burst sequentially into or out of the
device. The burst counter always starts with “00” internally in
the case of CY7C1517V18 and CY7C1528V18. On
CY7C1519V18 and CY7C1521V18, the burst counter takes in
the last two significant bits of the external address and bursts
four 18-bit words in the case of CY7C1519V18, and four 36-bit
words in the case of CY7C1521V18, sequentially into or out of
the device.
Asynchronous inputs include output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs, D) are tightly matched to the
two output echo clocks CQ/CQ, eliminating the need for
separately capturing data from each individual DDR-II SRAM
in the system design.Output data clocks (C/C) enable
maximum system clocking and data synchronization flexibility.
All Synchronous Input Pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks . Writes are conducted with on-chip
synchronous self-timed write circuitry.
250 MHz
250
850
San Jose
,
200 MHz
CA 95134-1709
200
750
Revised September 25, 2006
167 MHz
CY7C1517V18
CY7C1528V18
CY7C1519V18
CY7C1521V18
Architecture
167
700
408-943-2600
MHz
Unit
mA

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