CY7C1512AV18-200BZXC Cypress Semiconductor Corp, CY7C1512AV18-200BZXC Datasheet - Page 7

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CY7C1512AV18-200BZXC

Manufacturer Part Number
CY7C1512AV18-200BZXC
Description
IC SRAM 72MBIT 200MHZ 165TFBGA
Manufacturer
Cypress Semiconductor Corp

Specifications of CY7C1512AV18-200BZXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous, QDR II
Memory Size
72M (4M x 18)
Speed
200MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
165-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1512AV18-200BZXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1512AV18-200BZXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Document #: 38-05565 Rev. *E
Pin Definitions
Functional Overview
The CY7C1517V18, CY7C1528V18, CY7C1519V18, and
CY7C1521V18 are synchronous pipelined Burst SRAMs
equipped with a DDR interface.
Accesses are initiated on the rising edge of the positive input
clock (K). All synchronous input timing is referenced from the
rising edge of the input clocks (K and K) and all output timing
is referenced to the rising edge of the output clocks (C/C or
K/K when in single-clock mode).
All synchronous data inputs (D
registers controlled by the rising edge of the input clocks (K
and K). All synchronous data outputs (Q
output registers controlled by the rising edge of the output
clocks (C/C or K/K when in single clock mode).
All synchronous control (R/W, LD, BWS
through input registers controlled by the rising edge of the
input clock (K).
CY7C1519V18 is described in the following sections. The
same
CY7C1528V18 and CY7C1521V18.
Read Operations
The CY7C1519V18 is organized internally as a 4M x 18
SRAM. Accesses are completed in a burst of four sequential
18-bit data words. Read operations are initiated by asserting
CQ
CQ
ZQ
DOFF
TDO
TCK
TDI
TMS
NC
V
V
V
V
V
V
SS
SS
REF
DD
SS
DDQ
Pin Name
/144M
/288M
basic
Power Supply Power supply inputs to the core of the device.
Power Supply Power supply inputs for the outputs of the device.
Clock Output CQ is referenced with respect to C. This is a free running clock and is synchronized to the Input
Clock Output CQ is referenced with respect to C. This is a free running clock and is synchronized to the Input
descriptions
Reference
Ground
Output
(continued)
Input-
Input
Input
Input
Input
Input
Input
Input
N/A
I/O
clock for output data (C) of the DDR-II. In the single clock mode, CQ is generated with respect
to K. The timings for the echo clocks are shown in the AC Timing table.
clock for output data (C) of the DDR-II. In the single clock mode, CQ is generated with respect
to K. The timings for the echo clocks are shown in the AC Timing table.
Output Impedance Matching Input. This input is used to tune the device outputs to the system
data bus impedance. CQ, CQ, and Q
resistor connected between ZQ and ground. Alternately, this pin can be connected directly to
V
GND or left unconnected.
DLL Turn Off - active LOW. Connecting this pin to ground will turn off the DLL inside the device.
The timings in the DLL turned off operation will be different from those listed in this data sheet.
TDO for JTAG.
TCK pin for JTAG.
TDI pin for JTAG.
TMS pin for JTAG.
Not connected to the die. Can be tied to any voltage level.
Address expansion for 144M. Can be tied to any voltage level.
Address expansion for 288M. Can be tied to any voltage level.
Reference Voltage Input. Static input used to set the reference level for HSTL inputs and Outputs
as well as AC measurement points.
Ground for the device.
apply
DD
[x:0]
, which enables the minimum impedance mode. This pin cannot be connected directly to
) pass through input
to
[x:0]
[0:X]
CY7C1517V18,
) pass through
) inputs pass
R/W HIGH and LD LOW at the rising edge of the positive input
clock (K). The address presented to the Address inputs is
stored in the Read address register and the least two signif-
icant bits of the address are presented to the burst counter.
The burst counter increments the address in a linear fashion.
Following the next K clock rise the corresponding 18-bit word
of data from this address location is driven onto the Q
using C as the output timing reference. On the subsequent
rising edge of C the next 18-bit data word from the address
location generated by the burst counter is driven onto the
Q
have been driven out onto Q
valid 0.45 ns from the rising edge of the output clock (C or C,
or K or K when in single clock mode, 300-MHz, 250-MHz and
200-MHz device). In order to maintain the internal logic, each
Read access must be allowed to complete. Each Read access
consists of four 18-bit data words and takes two clock cycles
to complete. Therefore, Read accesses to the device can not
be initiated on two consecutive K clock rises. The internal logic
of the device will ignore the second Read request. Read
accesses can be initiated on every other K clock rise. Doing
so will pipeline the data flow such that data is transferred out
of the device on every rising edge of the output clocks (C/C or
K/K when in single-clock mode).
When read access is deselected, the CY7C1519V18 will first
complete the pending read transactions. Synchronous internal
circuitry will automatically tri-state the outputs following the
next rising edge of the positive output clock (C). This will allow
[17:0]
[x:0]
Pin Description
. This process continues until all four 18-bit data words
output impedance are set to 0.2 x RQ, where RQ is a
[17:0]
. The requested data will be
CY7C1517V18
CY7C1528V18
CY7C1519V18
CY7C1521V18
Page 7 of 28
[17:0]

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