MT48H4M16LFB4-10 Micron Technology Inc, MT48H4M16LFB4-10 Datasheet - Page 49

IC SDRAM 64MBIT 100MHZ 54VFBGA

MT48H4M16LFB4-10

Manufacturer Part Number
MT48H4M16LFB4-10
Description
IC SDRAM 64MBIT 100MHZ 54VFBGA
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48H4M16LFB4-10

Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
64M (4M x 16)
Speed
100MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-VFBGA
Organization
4Mx16
Density
64Mb
Address Bus
14b
Access Time (max)
8/7ns
Maximum Clock Rate
104MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
50mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Manufacturer
Quantity
Price
Part Number:
MT48H4M16LFB4-10
Manufacturer:
MICRON
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4 000
Part Number:
MT48H4M16LFB4-10
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48H4M16LFB4-10 IT
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Part Number:
MT48H4M16LFB4-10 IT TR
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Part Number:
MT48H4M16LFB4-10 TR
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Micron Technology Inc
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Part Number:
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Manufacturer:
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Quantity:
4 000
NOTE:
NOTE:
pdf: 09005aef80a63953, source: 09005aef808a7edc
Y25L_64Mb_2.fm - Rev. E 11/04 EN
1. For this example, the burst length = 1, and the WRITE burst is followed by a “manual” PRECHARGE.
2. 15ns is required between <D
3. A9 and A11 = “Don’t Care.”
4. PRECHARGE command not allowed else
1. CAS latency indicated in parentheses.
SYMBOL
t
t
t
t
AC (3)
AC (2)
CK (3)
CK (2)
t
t
t
t
CKH
t
t
CKS
AH
CH
AS
CL
DQMU, DQML
COMMAND
A0-A9, A11
BA0, BA1
1
CKE
A10
CLK
DQ
MIN
2.5
9.6
2.5
1
3
3
8
1
t CMS
t CKS
t AS
t AS
t AS
ACTIVE
-8
T0
ROW
ROW
BANK
MAX
t CKH
t CMH
t AH
t AH
t AH
100
100
7
8
Figure 45: Single WRITE – Without Auto Precharge
t RCD
t RAS
t RC
t CK
MIN
2.5
9.6
2.5
12
T1
1
3
3
1
NOP
IN
-10
m> and the PRECHARGE command, regardless of frequency.
DISABLE AUTO PRECHARGE
MAX
100
100
t CMS
t CL
7
8
t DS
COLUMN m 3
WRITE
BANK
T2
D
IN
t CMH
t CH
t DH
m
t
UNITS
t WR
RAS would be violated.
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
2
NOP 4
T3
49
NOP 4
SYMBOL
T4
t
t
WR (m)
WR (a)
t
t
t
t
CMH
CMS
t
t
RAS
t
RCD
t
DH
DS
RC
RP
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SINGLE BANK
PRECHARGE
ALL BANKS
T5
BANK
1 CLK
+7ns
MIN
2.5
2.5
48
80
19
19
15
1
1
-8
t RP
T6
NOP
120,000
MAX
MOBILE SDRAM
ACTIVE
BANK
ROW
T7
©2003 Micron Technology, Inc. All rights reserved.
1 CLK
+5ns
MIN
100
2.5
2.5
50
20
20
15
1
1
1
64Mb: x16
-10
NOP
120,000
T8
MAX
DON’T CARE
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns

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