MT48H4M16LFB4-10 Micron Technology Inc, MT48H4M16LFB4-10 Datasheet - Page 50

IC SDRAM 64MBIT 100MHZ 54VFBGA

MT48H4M16LFB4-10

Manufacturer Part Number
MT48H4M16LFB4-10
Description
IC SDRAM 64MBIT 100MHZ 54VFBGA
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48H4M16LFB4-10

Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
64M (4M x 16)
Speed
100MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-VFBGA
Organization
4Mx16
Density
64Mb
Address Bus
14b
Access Time (max)
8/7ns
Maximum Clock Rate
104MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
50mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
MT48H4M16LFB4-10
Manufacturer:
MICRON
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4 000
Part Number:
MT48H4M16LFB4-10
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48H4M16LFB4-10 IT
Manufacturer:
Micron Technology Inc
Quantity:
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Part Number:
MT48H4M16LFB4-10 IT TR
Manufacturer:
Micron Technology Inc
Quantity:
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Part Number:
MT48H4M16LFB4-10 TR
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Micron Technology Inc
Quantity:
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Part Number:
MT48H4M16LFB4-10:H
Manufacturer:
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Quantity:
4 000
NOTE:
NOTE:
pdf: 09005aef80a63953, source: 09005aef808a7edc
Y25L_64Mb_2.fm - Rev. E 11/04 EN
SYMBOL
1. For this example, the burst length = 1, and the WRITE burst is followed by a “manual” PRECHARGE.
2. 15ns is required between <D
3. A9 and A11 = “Don’t Care.”
4. WRITE command not allowed else
1. CAS latency indicated in parentheses.
DQMU, DQML
t
t
t
t
COMMAND
AC (3)
AC (2)
A0-A9, A11
CK (3)
CK (2)
t
t
t
t
CKH
t
CKS
t
BA0, BA1
AH
CH
AS
CL
CLK
CKE
A10
DQ
1
t CMS
t CKS
t AS
t AS
t AS
MIN
2.5
9.6
2.5
ACTIVE
T0
ROW
ROW
BANK
1
3
3
8
1
t CMH
t CKH
t AH
t AH
t AH
-8
t RCD
t RAS
t RC
MAX
100
100
7
8
t CK
T1
NOP 3
Figure 46: Single WRITE – With Auto Precharge
MIN
2.5
9.6
2.5
12
1
3
3
1
IN
-10
t CL
m> and the PRECHARGE command, regardless of frequency.
MAX
NOP 3
T2
100
100
7
8
t CH
t
RAS would be violated.
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOP 3
T3
ENABLE AUTO PRECHARGE
t CMS
t DS
COLUMN m 2
BANK
WRITE
T4
D
IN
t CMH
t DH
m
50
t WR
SYMBOL
t
t
WR (m)
WR (a)
t
t
t
t
CMH
CMS
t
RCD
t
RAS
t
t
DH
DS
RC
RP
T5
NOP
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1 CLK
MIN
+7ns
2.5
2.5
NOP
T6
48
80
19
19
15
1
1
-8
t RP
120,000
MAX
T7
NOP
MOBILE SDRAM
©2003 Micron Technology, Inc. All rights reserved.
1
1 CLK
MIN
+5ns
100
ACTIVE
ROW
ROW
BANK
2.5
2.5
50
20
20
15
T8
1
1
64Mb: x16
-10
DON’T CARE
120,000
MAX
T9
NOP
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns

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