PCA9550DP,118 NXP Semiconductors, PCA9550DP,118 Datasheet - Page 21

• Manufacturer Part Number: PCA9550DP,118
• Description: IC LED DRIVER BLINKER 8-TSSOP
• Manufacturer: NXP Semiconductors
• Type: LED Blinkerr

Specifications of PCA9550DP,118

• Package / Case: 8-TSSOP
• Topology: Open Drain, PWM
• Number Of Outputs: 2
• Internal Driver: Yes
• Type - Primary: LED Blinker
• Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Current - Output / Channel: 25mA
• Internal Switch(s): Yes
• Low Level Output Current: 6.5 mA
• Operating Supply Voltage: 2.3 V to 5.5 V
• Maximum Supply Current: 500 uA
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Number Of Segments: 2
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Package Type: TSSOP
• Pin Count: 8
• Mounting: Surface Mount
• Power Dissipation: 400mW
• Operating Supply Voltage (min): 2.3V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM6285 - EVAL BOARD I2C-2002-1A568-4002 - DEMO BOARD I2C
• Voltage - Output: -
• Efficiency: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-3387-2; 935272881118; PCA9550DP-T

NXP Semiconductors
14. Handling information
15. Soldering of SMD packages
PCA9550_5
Product data sheet
15.1 Introduction to soldering
15.2 Wave and reflow soldering
15.3 Wave soldering
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Key characteristics in wave soldering are:
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Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
Rev. 05 — 13 October 2008
2-bit I
2
C-bus LED driver with programmable blink rates
PCA9550
© NXP B.V. 2008. All rights reserved.
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