BSP742T Infineon Technologies, BSP742T Datasheet - Page 16

IC POWER HI SIDE SWITCH P-DSO-8

BSP742T

Manufacturer Part Number
BSP742T
Description
IC POWER HI SIDE SWITCH P-DSO-8
Manufacturer
Infineon Technologies
Series
miniPROFET®r
Type
High Sider
Datasheets

Specifications of BSP742T

Package / Case
DSO-8
Input Type
Non-Inverting
Number Of Outputs
1
On-state Resistance
260 mOhm
Current - Output / Channel
1.1A
Current - Peak Output
4A
Voltage - Supply
5 V ~ 34 V
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
On Resistance (max)
350 mOhms
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 40 C
Maximum Power Dissipation
1.5 W
Mounting Style
SMD/SMT
Off Time (max)
170 us
On Time (max)
140 us
Supply Current
5 mA
Supply Voltage (max)
40 V
Switch Configuration
N-Channel
Switch Current (typ)
0.8 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
BSP742TINTR
BSP742TNT
BSP742TT
BSP742TXT
BSP742TXTINTR
BSP742TXTINTR
SP000011138
SP000311133

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Published by
Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81669 München
© Infineon Technologies AG 2001
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee
of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
Infineon Technologies is an approved CECC manufacturer.
Information
nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide
(see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the
types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system. Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Package:
regarding circuits, descriptions and charts stated herein.
For further information on technology, delivery terms and conditions and prices please contact your
P-DSO-8-6
Package and ordering code
all dimensions in mm
Ordering code:
Q67060-S7300-A2
Page 16
Printed circuit board (FR4, 1.5mm thick, one
layer 70µm, 6cm 2 active heatsink area ) as
a reference for max. power dissipation P
nominal load current I
resistance R
thja
L(nom)
and thermal
2004-01-27
BSP 742 T
tot

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