FPF2194 Fairchild Semiconductor, FPF2194 Datasheet - Page 13

• Manufacturer Part Number: FPF2194
• Description: IC LOAD SWITCH FULL FUNCT 6WLCSP
• Manufacturer: Fairchild Semiconductor
• Type: High Side Switchr

Specifications of FPF2194

• Number Of Outputs: 1
• Rds (on): 80 mOhm
• Internal Switch(s): Yes
• Current Limit: Adjustable
• Voltage - Input: 1.8 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-WLCSP
• Input Voltage: 1.8 to 5.5V
• Power Switch On Resistance: 55mOhm
• Output Current: 600mA
• Mounting: Surface Mount
• Package Type: CSP
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Pin Count: 6
• Power Dissipation: 1.2W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: FPF2194TR

© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.4
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Product
FPF2193
FPF2194
FPF2195
INDEX AREA
2X
BALL A1
1.00
0.03 C
0.05 C
BOTTOM VIEW
0.50
0.50
C
TOP VIEW
1 2
Figure 29.
E
1.500+/-0.030
1.500+/-0.030
1.500+/-0.030
C
B
A
SEATING PLANE
(X) ±0.018
A
D
0.625
0.539
Ø0.315 +/- .025
6X
D
B
(Y) ±0.018
2X
0.06 C
6-Ball, Wafer-Level Chip-Scale Package (WLCSP)
F
0.005
0.03 C
E
F
C A B
D
SIDE VIEWS
1.000+/-0.030
1.000+/-0.030
1.000+/-0.030
NOTES:
13
E
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
D. DATUM C IS DEFINED BY THE SPHERICAL
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
F. FOR DIMENSIONS D, E, X, AND Y SEE
G. DRAWING FILNAME: MKT-UC006AFrev2.
A. NO JEDEC REGISTRATION APPLIES.
SOLDER MASK
±43 MICRONS (539-625 MICRONS).
PER ASMEY14.5M, 1994.
CROWNS OF THE BALLS.
OPENING
PRODUCT DATASHEET.
(Ø0.350)
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
A1
0.240
0.240
0.240
X
(0.50)
0.332±0.018
(1.00)
0.250±0.025
(Ø0.250)
Cu Pad
0.240
0.240
0.240
www.fairchildsemi.com
Y