TLE7809G Infineon Technologies, TLE7809G Datasheet
TLE7809G
Specifications of TLE7809G
Related parts for TLE7809G
TLE7809G Summary of contents
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... Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 16.4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 17 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 18 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 18.1 Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 18.2 Hints for Unused Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 18.3 Flash Program Mode via LIN-Fast-Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 18.4 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 19 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 20 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Data Sheet 2 TLE7809G Table of Contents Rev. 3.01, 2008-04-15 ...
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... UART and Synchronous Serial Channel (SSC respective SPI) General Characteristics • Package PG-DSO-28- -40 ° 125 °C (for industrial applications) • Temperature Range J • Green Package (RoHS compliant) Type TLE7809G Data Sheet V -Measurement bat Package PG-DSO-28-21 3 TLE7809G PG-DSO-28-21 Marking TLE7809G Rev. 3.01, 2008-04-15 ...
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... A wake-up from the low power mode is possible via a LIN bus message or wake-up inputs. This integrated circuit is realized as Multi-Chip-Module (MCM PG-DSO-28-21 package, and is designed to withstand the severe conditions of industrial applications. Note: A detailed description of the 8-bit microcontroller XC866 can be found in a dedicated User’s Manual and Data Sheet. Data Sheet 4 TLE7809G Overview Rev. 3.01, 2008-04-15 ...
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... Figure 1 Functional Block Diagram (Module Overview) Data Sheet SBC Voltage Regulator SPI Diagnostic / Ctrl. Watchdog Temp bat Measurement I/F LIN 5 TLE7809G Block Diagram 8-bit µC On-Chip Oscillator Flash JTAG GPIOs Hall Sensor I/F Reset 10-bit ADC Serial I/F Rev. 3.01, 2008-04-15 ...
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... Range” on Page Reset; output of SBC; “low active”; input for μController 8 RESET Data Sheet 28 MON2 27 MON1 SUPPLY TLE7809G V 23 GND 22 GND P2.1/CCPOS1_0/EXINT2/T13HR_2/TDI_1/CC62_3/AN1 19 18 P2.0/CCPOS0_0/EXINT1/T12HR_2/TCK_1/CC61_3/AN0 P0.1/TDI_0/T13HR_1/RXD_1/EXF2_1/COUT61_1 17 P0.2/CTRAP_2/TDO_0/TXD_1 16 P0.0/TCK_0/T12HR_1/CC61_1/CLKOUT/RXDO_1 15 34) 6 TLE7809G Pin Definitions and Functions BAT_SENSE S CC DDP Table 13 Rev. 3.01, 2008-04-15 ...
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... CSN terminal low; CSN input should only be transitioned when CLK is low; CSN has an internal pull-up and requires CMOS logic level inputs; connected to µC General Purpose Input P1.5 V – Voltage Reference for ADC AREF Data Sheet Pin Definitions and Functions 7 TLE7809G V pin CC Rev. 3.01, 2008-04-15 ...
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... GND AREF AREF VA P2.7 TxD P1.1 P1.0 RxD P1.5 CSN P1.2 CLK DI P1.3 P1.4 DO ERR P3 GND RESET 8 TLE7809G Pin Definitions and Functions V DDP V P2.1 P2.0 GND DDP 8-Bit µ P0.3 P0.4 Rev. 3.01, 2008-04-15 P0.1 17 [TDI_0] P0.2 16 [TDO_0] P0.0 15 [TCK_0] 14 TMS ...
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... Operating Modes The TLE7809G incorporates several SBC operating modes, that are listed in Table 1 SBC Operating Modes Functional Block SBC Standby Mode LDO ON CC Window Watchdog ON Monitoring / wake-up pins ON / OFF LS1,LS2 -switch OFF Supply Output ON / OFF HS-LED OFF 16-bit SPI ON LIN wake-up via bus ...
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... The SBC Active Mode is used to transmit and receive LIN messages and provides the sub-mode “LIN Sleep”. Data Sheet SBC Stand-By Vcc ON Vcc ON Vcc ON on wake-up / after reset 10 TLE7809G Operating Modes SBC Sleep Mode MS2 MS1 MS0 Vcc OFF LIN Receive-Only ...
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... The main difference between the SBC Active Mode and the LIN Receive-Only Mode is that the LIN transmit stage is automatically turned-off in LIN Receive-Only-Mode. However, the LIN receiver is still active in both modes. 1 Figure 5 Network Diagram “LIN Receive-Only Mode” Data Sheet TLE7809G Operating Modes 4 3 Rev. 3.01, 2008-04-15 ...
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... Table 2 “SPI Input Data Bits” on Page SBC Standby Mode SBC Sleep Mode MS1 MS0 Vcc OFF 12 TLE7809G Operating Modes 20) the oscillator Start Up Power Up Vcc ON transition caused event at MONx inputs - LIN message [SPI indicates source] Rev. 3.01, 2008-04-15 ...
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... Data Sheet Figure Table 14 and “Window Watchdog Reset Period Settings” on Page SBC Standby Mode SBC Stop Mode MS1 MS0 Vcc TLE7809G Operating Modes 7).) Figure 10, Watchdog Start Up Power Up Vcc ON transition caused event at MONx inputs - LIN message [SPI indicates source] wake event notification [to µC]: - LIN msg. => ...
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... LIN message independent of cyclic wake phase („asynchronous“ Operating Modes Figure 10). Start Up Power Up Vcc ON select SBC operating mode µC 2) transition caused by: - event at MONx inputs: => DO „low“ - LIN message => RxD + DO „low“ [SPI indicates source] cyclic wake-up µC wake-up inputs Rev. 3.01, 2008-04-15 TLE7809G 1) ...
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... LIN Transceiver The TLE7809G offers a LIN transceiver, which is compatible to ISO9141 and certified according to LIN Specification 1.3 and 2.0 “Physical Layer”. The transceiver has a pull-up resistor of 30 kΩ implemented and is protected against short to battery and short to GND. The LIN transceiver has an implemented wake-up capability during operation in power saving modes. In Stop Mode a wake-up event is indicated via (internal) RxD and DO signals, that are pulled “ ...
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... V ≤ SENS bat f – VSENS ) ] c – ADC Measurement Interface V bat_sense V is provided by the AREF μC SBC VAREF VA P2.7 ADC AGND V SENS can be calculated with the following equation The correction BAT_SENSE Rev. 3.01, 2008-04-15 TLE7809G ) and an on the voltage (1) (2) (3) ...
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... Temperature Measurement Interface” – • are computed during the production test and stored in the flash memory of the 19). 17 ADC Measurement Interface 43. 43) V and N denote the ADC reference AREF is given by: A [unit: K] Rev. 3.01, 2008-04-15 TLE7809G (4) (5) (6) (7) “SPI (Serial ...
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... Low Dropout Voltage Regulator The Low Drop-Out Voltage Regulator (LDO) has mainly been integrated in the TLE7809G in order to supply the integrated microcontroller and several modules of the SBC. Note: The LDO is not intended to be used as supply for external loads. However, it might be used as supply for small external loads (see Table 13 “ ...
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... On /Off disable Cyclic Wake Timing* Bit Position Window Watchdog Timing 0** Bit Position (Watchdog Trigger Register ) * remains unchanged after Vcc-UV or WD-RESET ** if bit set to „1" command will be ignored 19 TLE7809G SPI (Serial Peripheral Interface read in via the data input DI (with “LSB LSB CS1 CS0 ...
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... SBC Active Mode: “LIN Sleep” SBC Active Mode (LIN “on”) SBC Sleep (LIN & VReg “off”) “reserved” / not used LIN Transceiver: LIN Receive-Only SBC Stop Mode (LIN “off”) 20 TLE7809G SPI (Serial Peripheral Interface) Rev. 3.01, 2008-04-15 ...
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... Watchdog Period Bit 3 (T3) Watchdog Period Bit 4 (T4) Watchdog Period Bit 5 (T5) “0” (mandatory) “reserved” / not used “reserved” / not used Table 7 “Cyclic Wake Period Settings (Stop Mode only)” SPI (Serial Peripheral Interface) 2) 1)2) Rev. 3.01, 2008-04-15 TLE7809G OV/UV bat bat ...
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... Wake-Up via MON1 Wake-Up via MON2 Wake-Up via MON3 Wake-Up via MON4 Wake-Up via MON5 “reserved” / not used Bus Wake-Up via LIN Msg. End of Cyclic Wake Period 4) “low” 22 TLE7809G SPI (Serial Peripheral Interface) Cyclic Wake Period Cyclic Wake “off” … ms ...
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... Table 11 “Reset Behavior SBC” on Page 25 LSx-shutdown; SPI status output; signalization via ERR pin LSx-shutdown; see “Error Interconnect (ERR)” on Page 32 Supply-shutdown; SPI status output 23 TLE7809G 2) Concept SPI status latched until next read-out – V Condition occurs at S below operating range – ...
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... DO “low”) and SPI status output signalization via interconnect to μC (DO “low”) and SPI status output signalled at interconnect (DO “high” OR-ed with DI) once CSN is active 24 TLE7809G Concept re-activation via SPI command; SPI status latched until next read-out re-activation via SPI command; SPI status ...
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... Then the watchdog again starts by opening a long open window. In addition, a “window watchdog reset flag” is set within the SPI to monitor a watchdog reset. For fail safe reasons the TLE7809G is automatically switched to SBC Standby mode if a watchdog trigger failure occurs. This minimizes the power consumption in case of a permanent faulty microcontroller. This “ ...
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... In addition to a wake-up from SBC Stop / Sleep Mode via the LIN bus line it is also possible to wake-up the TLE7809G from low power mode via the monitoring/wake-up inputs. These inputs are sensitive to a transition of the voltage level, either from high to low or vice versa. Monitoring is available in Active Mode and indicates the voltage level of the inputs via SPI status bits ...
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... I MON Figure 12 Monitoring Input Characteristics Data Sheet Monitoring / Wake-Up Inputs MON1 … 5 and Wake-Up Event Signalling V V MONth_min MONth_max Pull-down current Pull-up current 27 TLE7809G V MON Rev. 3.01, 2008-04-15 ...
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... The LSx can also be switched off by the microcontroller by pulling the bi-directional ERR interconnect “low” for at least one internal cycle (see “SBC Oscillator” on Page Data Sheet “SBC Oscillator” on Page 36). The drivers have to be 36). 28 TLE7809G Low Side Switches Rev. 3.01, 2008-04-15 ...
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... SPI command. In order to prevent an unintended shut-down due to an overcurrent situation when a capacitive load is connected, a specified blanking time after switching-on has been implemented and is applied directly after activation of this output. Data Sheet Supply Output for Hall Sensor Supply 29 TLE7809G Rev. 3.01, 2008-04-15 ...
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... This HS-LED OV/UV feature can be disabled via SPI bit (see Configuration” on Page 21). Data Sheet -UV) and overvoltage condition ( 30 High-Side Switch as LED Driver (HS-LED) V -OV) and can only be re-activated via SPI bat Table 5 “General & Integrated Switch Rev. 3.01, 2008-04-15 TLE7809G ...
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... The pins P0.3 / P0.4 / P0.5 and P2.0 / P2.1 provide general purpose functionality, like Hall Sensor inputs, PWM output and capture. GPIOs P0.0, P0.1 and P0.2 are available in user mode only (alternate JTAG functionality). For further information see dedicated XC866 User’s Manual and/or Data Sheet. Data Sheet General Purpose I/Os (GPIO) 31 TLE7809G Rev. 3.01, 2008-04-15 ...
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... LS1/LS2 are turned off (see Page 23). Data Sheet “SBC Oscillator” on Page Table 10 “Diagnostic, Protection and Safety Functions” TLE7809G Error Interconnect (ERR) 36), the Rev. 3.01, 2008-04-15 ...
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... ESD ESD V -500 500 ESD T -40 125 j T -50 150 stg 33 TLE7809G General Product Characteristics Unit Conditions V – V – V also for pulses according to ISO 7637; external series R resistor > 1.0 kΩ required MON5 input voltage limited due to LED driver functionality. R > 1.0 kΩ required ...
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... T -40 125 – chmode Symbol Limit Values Min. Typ – – thJSP R – 43 thJA 34 TLE7809G General Product Characteristics Unit Conditions load dump; ≤ t 27V jump start; V valid for ramp-down S (min load dump; can withstand short circuit V ≤ 20V external loads V/μ ...
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... SBC_Stby I – 25 MCM_Sleep V 4.9 5.0 CC Δ V – – CC Δ V – – CC PSRR – TLE7809G General Product Characteristics Unit Conditions Max -40 … 85 ° SBC: active mode μC: normal mode = -40 … 85 ° w/o data transmission; only SBC; all switches “off” -40 … 85 ° only μ ...
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... V 17.6 18.5 OVT_Vbat V 16.6 17.4 OVT_Vbat V – 1.1 OVT_Vbat_hys Pin V 5.8 6.5 UVT_Vs V – 250 UVT_Vs_hys t 3.2 3.9 CYL 36 TLE7809G General Product Characteristics Unit Conditions Max. V 200 power transistor thermally monitored I 0 < < 3.9 V < < 5 °C 1) 170 1) – ...
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... RD2 0 WDI,th V 3.7 4 4.3 MONth 600 MONth,hys MON I - PU, MONx PD, MONx LK LK LK_MON5,I 37 TLE7809G General Product Characteristics Unit Conditions pin , default SPI CC setting pin , SPI option for RESET RTx = 200 μA for I RESET ≥ > RTx – CC μ RESET μ < RESET = “low” ...
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... DROP_Supply V 2.7 – 18.0 SUPPLY I -5 – – QL_SUPPLY t – – 200 ON_SUPPLY t – – 100 OFF_SUPPLY I -80 -40 -20 SD_SUPPLY 38 TLE7809G General Product Characteristics Unit Conditions Ω ° 125 > 4 200 mA Ω 25° > 4 200 mA V output “off”; current pulse 100 mA ...
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... V – bus, 0.58 × – – busrec V S 0.5 × V 0.475 0.525 buscent × × TLE7809G General Product Characteristics Unit Conditions μs – μs overcurrent will be indicated/shutdown will be initiated after continuous detection of overcurrent condition ° Ω °C; 125 -45 mA HS-LED Ω ...
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... I 40 100 150 bus,sc I -500 -140 – bus,lk – – – – – TLE7809G General Product Characteristics Unit Conditions bus,hys bus,rec bus,dom (LIN Spec 1.3 (2.0); Line 10.1.12 (3.1.12)) V – µs Note: RC filter between LIN and RxD signal V ...
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... TLE7809G General Product Characteristics Unit Conditions kΩ Active/Standby Mode (LIN Spec 1.3 (2.0); Line 10.2.2 (3.2.2)) μA V Sleep mode bus V V/μs 60% > > 40%; bus 1 μs < (τ = × bus < 5 μs; ...
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... CLKL t 125 – bef t 250 – lead t 250 – lag t 125 – beh t 50 – DISU 42 TLE7809G General Product Characteristics Unit Conditions Max. μs – duty cycle 1: (max) = 0.744 × TH Rec (max) = 0.581 × TH Dom V = 7.0 … μs; t bit bus_rec(min) (LIN Spec 2.0 ...
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... T – – 30 set T -40 – 125 J m – 3.82 – – 5.94 – TLE7809G General Product Characteristics Unit Conditions ns – ns – ns – μs – μs – 100 100 low impedance ns high impedance 4) V interconnect V – ...
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... J T – – set Actual data Previous status Old data 44 TLE7809G Timing Diagrams Unit Conditions Max. °C -40 °C < < 125°C J μ after measurement mode change; CSN “high” to settled output voltage at V interconnect A time time New data time Actual status ...
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... Figure 14 SPI-Input Timing t t CWmax t CWmin closed window Figure 15 Watchdog Time-Out Definitions Data Sheet WD t OWmax t OWmin open window safe trigger area 45 TLE7809G Timing Diagrams WDPER Rev. 3.01, 2008-04-15 ...
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... CC V RTx t RD1 WD Trigger Reset Out Watchdog timer reset start up Figure 17 Reset Timing Diagram Data Sheet RDx timeout (too long) t < RDx normal operation 46 TLE7809G Timing Diagrams normal timeout normal operation (too short) operation RDx undervoltage start up t Rev. 3.01, 2008-04- ...
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... TxD GND bus GND RxD GND Figure 18 LIN Dynamic Characteristics Timing Diagram Data Sheet t t d(L),T d(H),T V bus, d(H),R d(L),R 0.3 d(L),TR d(H),TR 47 TLE7809G Timing Diagrams t V bus,dr t 0.7 Rev. 3.01, 2008-04-15 ...
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... MON5/HS-LED, LIN: leave open Data Sheet LIN GND VBAT_SENSE VS 10uF MON5/HS_LED LS 1 TLE7809G LS 2 PWM SUPPLY Speed CCPOS0 Direction CCPOS1 48 TLE7809G Application Information >1k MON1 >1k MON2 >1k MON3 >1k MON4 220nF VDDC 100nF VCC VDDP 1uF Rev. 3.01, 2008-04-15 ...
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... Total chip power dissipation [ • = Chip internal power dissipation [W] INT P • = Power dissipation caused by I/O currents [ • = Package thermal resistance [K/W]; junction-ambient thJA The total power dissipation can be calculated from INT IO Data Sheet Application Information Rev. 3.01, 2008-04-15 TLE7809G LSB (8) (9) ...
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... Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 7.6 0.1 0.2 28x 18.1 -0.4 50 TLE7809G Package Outlines 0.35 x 45˚ 1) -0.2 +0.8 0.4 10.3 ±0.3 Dimensions in mm Rev. 3.01, 2008-04-15 GPS05123 ...
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... Revision History Revision Date Changes 3.01 2008-04-15 Chapter 16.3 Thermal Resistance - corrected RthJSP 3.00 2008-04-04 Initial datasheet version Data Sheet (16.3.1) 51 TLE7809G Revision History Rev. 3.01, 2008-04-15 ...
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... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life ...