FAN5236QSC Fairchild Semiconductor, FAN5236QSC Datasheet - Page 17

IC CTRLR DDR/PWM DUAL HE 28QSOP

FAN5236QSC

Manufacturer Part Number
FAN5236QSC
Description
IC CTRLR DDR/PWM DUAL HE 28QSOP
Manufacturer
Fairchild Semiconductor
Datasheets

Specifications of FAN5236QSC

Applications
Controller, Mobile-Friendly DDR
Voltage - Input
5 ~ 24 V
Number Of Outputs
2
Voltage - Output
0.9 ~ 5 V
Operating Temperature
-10°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
28-QSOP
Operating Temperature Range
- 10 C to + 85 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FAN5236QSC_NL
FAN5236QSC_NL

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FAN5236
Layout Considerations
Switching converters, even during normal operation,
produce short pulses of current which could cause substan-
tial ringing and be a source of EMI if layout constrains are
not observed.
There are two sets of critical components in a DC-DC
converter. The switching power components process large
amounts of energy at high rate and are noise generators. The
low power components responsible for bias and feedback
functions are sensitive to noise.
A multi-layer printed circuit board is recommended. Dedi-
cate one solid layer for a ground plane. Dedicate another
solid layer as a power plane and break this plane into smaller
islands of common voltage levels.
Notice all the nodes that are subjected to high dV/dt voltage
swing such as SW, HDRV and LDRV, for example. All
surrounding circuitry will tend to couple the signals from
these nodes through stray capacitance. Do not oversize
copper traces connected to these nodes. Do not place traces
connected to the feedback components adjacent to these
traces. It is not recommended to use High Density Intercon-
nect Systems, or micro-vias on these signals. The use of
blind or buried vias should be limited to the low current
signals only. The use of normal thermal vias is left to the
discretion of the designer.
REV. 1.1.9 7/12/04
Keep the wiring traces from the IC to the MOSFET gate and
source as short as possible and capable of handling peak
currents of 2A. Minimize the area within the gate-source
path to reduce stray inductance and eliminate parasitic ring-
ing at the gate.
Locate small critical components like the soft-start capacitor
and current sense resistors as close as possible to the respec-
tive pins of the IC.
The FAN5236 utilizes advanced packaging technologies
with lead pitches of 0.6mm. High performance analog semi-
conductors utilizing narrow lead spacing may require special
considerations in PWB design and manufacturing. It is
critical to maintain proper cleanliness of the area surround-
ing these devices.
PRODUCT SPECIFICATION
17

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