BGF 200 E6327 Infineon Technologies, BGF 200 E6327 Datasheet - Page 4

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BGF 200 E6327

Manufacturer Part Number
BGF 200 E6327
Description
IC FILTER/ESD PROT RF S-WLP-8
Manufacturer
Infineon Technologies
Datasheet

Specifications of BGF 200 E6327

Applications
*
Mounting Type
Surface Mount
Package / Case
WLP-8-4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BGF200E6327XT
SP000055123
Microphone Filter and ESD Protection
Feature
Figure 1
Description
The BGF200 is a microphone filter with low pass characteristic offering a very high stop band attenuation up to 6
GHz. All pins are protected against ESD. The wafer level package is a green package with a size of only 1.6 mm
x 1.6 mm and a total height of 0.65 mm.
Type
BGF200
Table 1
Parameter
Voltage at pin A2 to GND
Voltage at all other pins to GND
Operating temperature range
Storage temperature range
Summed up input power for all pins
Electrostatic Discharge According to IEC61000-4-2
Between pins C3 and B3
Between all other pins
1) Contact discharge
Data Sheet
Microphone filter
Integrated ESD protection up to 15 kV
Low input impedance
More than 30 dB stopband attenuation
Ideal for GSM/UMTS
Wafer Level Package with SnAgCu-Bumps
Blockdiagram
Maximum Ratings
Package
WLP-8-4
C3
B2 B3 C2
Symbol
V
V
T
T
P
V
V
OP
STG
A2
P
IN
E
I
1)
Marking
GF200
4
BGF200_Blockdiagram.vsd
Min.
0
-14
-40
-65
-15
-2
A3
A2
Values
Typ.
Microphone Filter and ESD Protection
C1
B1
Max.
4.0
14
+85
+150
25
15
2
Chip
N0703
Unit
V
V
°C
mW
kV
kV
WLP-8-1,- 2, -4
C
Note /
Test Condition
T
A
V2.1, 2006-10-17
< 70 °C
BGF200

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