PCM18XT0 Microchip Technology, PCM18XT0 Datasheet - Page 460

• Manufacturer Part Number: PCM18XT0
• Description: MODULE PROC PIC18F4685
• Manufacturer: Microchip Technology

Specifications of PCM18XT0

• Accessory Type: Processor Module
• Product: Microcontroller Modules
• Core Processor: PIC18F4685
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: ICE2000
• For Use With: ICE2000 - EMULATOR MPLAB-ICE 2000 POD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

PIC18F2682/2685/4682/4685
DS39761C-page 460
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
A2
Units
E1
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
α
E
2.05
0.10
0.25
0.40
0.18
0.31
MIN
φ
0°
5°
5°
–
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
© 2009 Microchip Technology Inc.
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
β
–
c