PCM18XT0 Microchip Technology, PCM18XT0 Datasheet - Page 6

• Manufacturer Part Number: PCM18XT0
• Description: MODULE PROC PIC18F4685
• Manufacturer: Microchip Technology

Specifications of PCM18XT0

• Accessory Type: Processor Module
• Product: Microcontroller Modules
• Core Processor: PIC18F4685
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: ICE2000
• For Use With: ICE2000 - EMULATOR MPLAB-ICE 2000 POD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

PIC18F2682/2685/4682/4685
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 131
11.0 Timer0 Module ......................................................................................................................................................................... 149
12.0 Timer1 Module ......................................................................................................................................................................... 153
13.0 Timer2 Module ......................................................................................................................................................................... 159
14.0 Timer3 Module ......................................................................................................................................................................... 161
15.0 Capture/Compare/PWM (CCP1) Modules ............................................................................................................................... 165
16.0 Enhanced Capture/Compare/PWM (ECCP1) Module.............................................................................................................. 175
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 189
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 229
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 249
20.0 Comparator Module.................................................................................................................................................................. 259
21.0 Comparator Voltage Reference Module ................................................................................................................................... 265
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 269
23.0 ECAN™ Technology ................................................................................................................................................................ 275
24.0 Special Features of the CPU .................................................................................................................................................... 345
25.0 Instruction Set Summary .......................................................................................................................................................... 365
26.0 Development Support............................................................................................................................................................... 415
27.0 Electrical Characteristics .......................................................................................................................................................... 419
28.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 455
29.0 Packaging Information.............................................................................................................................................................. 457
Appendix A: Revision History............................................................................................................................................................. 465
Appendix B: Device Differences......................................................................................................................................................... 465
Appendix C: Conversion Considerations ........................................................................................................................................... 466
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 466
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 467
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 467
The Microchip Web Site ..................................................................................................................................................................... 481
Customer Change Notification Service .............................................................................................................................................. 481
Customer Support .............................................................................................................................................................................. 481
Reader Response .............................................................................................................................................................................. 482
PIC18F2682/2685/4682/4685 Product Identification System ............................................................................................................ 483
DS39761C-page 6
Device Overview .......................................................................................................................................................................... 9
Oscillator Configurations ............................................................................................................................................................ 25
Power-Managed Modes ............................................................................................................................................................. 35
Reset .......................................................................................................................................................................................... 43
Memory Organization ................................................................................................................................................................. 63
Flash Program Memory .............................................................................................................................................................. 97
Data EEPROM Memory ........................................................................................................................................................... 107
8 x 8 Hardware Multiplier.......................................................................................................................................................... 113
Interrupts .................................................................................................................................................................................. 115
© 2009 Microchip Technology Inc.