PCM18XT0 Microchip Technology, PCM18XT0 Datasheet - Page 461
![MODULE PROC PIC18F4685](/photos/8/96/89696/pcm18xt0_sml.jpg)
PCM18XT0
Manufacturer Part Number
PCM18XT0
Description
MODULE PROC PIC18F4685
Manufacturer
Microchip Technology
Datasheet
1.PCM18XT0.pdf
(484 pages)
Specifications of PCM18XT0
Accessory Type
Processor Module
Product
Microcontroller Modules
Core Processor
PIC18F4685
Lead Free Status / RoHS Status
Not applicable / Not applicable
For Use With/related Products
ICE2000
For Use With
ICE2000 - EMULATOR MPLAB-ICE 2000 POD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Not applicable / Not applicable
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© 2009 Microchip Technology Inc.
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
PIC18F2682/2685/4682/4685
Dimension Limits
Units
A2
A1
E1
eB
b1
N
D
e
A
E
L
b
c
e
A2
1.980
.125
.015
.590
.485
.115
.008
.030
.014
MIN
E1
–
–
L
.100 BSC
INCHES
NOM
40
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-016B
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
–
DS39761C-page 461
c
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