LPC2138FHN64/01,55 NXP Semiconductors, LPC2138FHN64/01,55 Datasheet - Page 39

• Manufacturer Part Number: LPC2138FHN64/01,55
• Description: IC ARM7 MCU FLASH 512K 64-HVQFN
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2138FHN64/01,55

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 47
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C/SPI/SSP/UART
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 47
• Number Of Timers: 2
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, KSK-LPC2138, KSK-LPC2138-PL
• Development Tools By Supplier: OM10045, OM10070, OM10089
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (8-ch x 10-bit)
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCD568-4298 - BOARD EVAL LPC213X KS213X568-4297 - BOARD EVAL LPC21XX MCB2100MCB2130UME - BOARD EVAL MCB2130 + ULINK-MEMCB2130U - BOARD EVAL MCB2130 + ULINK2MCB2130 - BOARD EVAL NXP LPC213X ARM FAM622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-2095 - BOARD EVAL FOR LPC213X ARM MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4011; 935281779557; LPC2138FHN64/01

NXP Semiconductors
13. Package outline
Fig 16. Package outline SOT314-2 (LQFP64)
LPC2131_32_34_36_38
Product data sheet
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT314-2
max.
1.6
A
49
64
y
48
0.20
0.05
A
1
1
e
1.45
1.35
A
2
pin 1 index
136E10
IEC
0.25
A
b
3
p
H
D
D
0.27
0.17
b
p
w
M
0.18
0.12
c
X
All information provided in this document is subject to legal disclaimers.
MS-026
JEDEC
10.1
D
9.9
16
Z D
33
(1)
REFERENCES
17
32
Rev. 5 — 2 February 2011
10.1
E
9.9
(1)
Z E
0
b
B
0.5
e
w
p
e
v
M
v
M
JEITA
scale
12.15
11.85
2.5
M
H
B
D
A
A
E
12.15
11.85
H
H
E
E
5 mm
L
1
LPC2131/32/34/36/38
A
0.75
0.45
L
A
p
Single-chip 16/32-bit microcontrollers
2
A
1
0.2
v
0.12
w
PROJECTION
EUROPEAN
detail X
0.1
y
Z
1.45
1.05
D
(1)
L
© NXP B.V. 2011. All rights reserved.
Z
1.45
1.05
L
E
p
ISSUE DATE
(1)
00-01-19
03-02-25
(A )
7
0
θ
SOT314-2
3
o
o
θ
39 of 45