LPC2138FHN64/01,55 NXP Semiconductors, LPC2138FHN64/01,55 Datasheet - Page 44

IC ARM7 MCU FLASH 512K 64-HVQFN

LPC2138FHN64/01,55

Manufacturer Part Number
LPC2138FHN64/01,55
Description
IC ARM7 MCU FLASH 512K 64-HVQFN
Manufacturer
NXP Semiconductors
Series
LPC2100r

Specifications of LPC2138FHN64/01,55

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
Core Processor
ARM7
Core Size
16/32-Bit
Speed
60MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
47
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC21
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
32 KB
Interface Type
I2C/SPI/SSP/UART
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
47
Number Of Timers
2
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, KSK-LPC2138, KSK-LPC2138-PL
Development Tools By Supplier
OM10045, OM10070, OM10089
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (8-ch x 10-bit)
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCD568-4298 - BOARD EVAL LPC213X KS213X568-4297 - BOARD EVAL LPC21XX MCB2100MCB2130UME - BOARD EVAL MCB2130 + ULINK-MEMCB2130U - BOARD EVAL MCB2130 + ULINK2MCB2130 - BOARD EVAL NXP LPC213X ARM FAM622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-2095 - BOARD EVAL FOR LPC213X ARM MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4011
935281779557
LPC2138FHN64/01
NXP Semiconductors
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
17. Contact information
For more information, please visit:
For sales office addresses, please send an email to:
LPC2131_32_34_36_38
Product data sheet
http://www.nxp.com
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
salesaddresses@nxp.com
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I
2
C-bus — logo is a trademark of NXP B.V.
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
© NXP B.V. 2011. All rights reserved.
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