LPC2138FHN64/01,55 NXP Semiconductors, LPC2138FHN64/01,55 Datasheet - Page 3

• Manufacturer Part Number: LPC2138FHN64/01,55
• Description: IC ARM7 MCU FLASH 512K 64-HVQFN
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2138FHN64/01,55

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 47
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C/SPI/SSP/UART
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 47
• Number Of Timers: 2
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, KSK-LPC2138, KSK-LPC2138-PL
• Development Tools By Supplier: OM10045, OM10070, OM10089
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (8-ch x 10-bit)
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCD568-4298 - BOARD EVAL LPC213X KS213X568-4297 - BOARD EVAL LPC21XX MCB2100MCB2130UME - BOARD EVAL MCB2130 + ULINK-MEMCB2130U - BOARD EVAL MCB2130 + ULINK2MCB2130 - BOARD EVAL NXP LPC213X ARM FAM622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-2095 - BOARD EVAL FOR LPC213X ARM MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4011; 935281779557; LPC2138FHN64/01

NXP Semiconductors
LPC2131_32_34_36_38
Product data sheet
3.1 Ordering options
Table 1.
Table 2.
Type number
LPC2136FBD64
LPC2136FBD64/01 LQFP64
LPC2138FBD64
LPC2138FBD64/01 LQFP64
LPC2138FHN64
LPC2138FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
Type number
LPC2131FBD64
LPC2131FBD64/01
LPC2132FBD64
LPC2132FBD64/01
LPC2132FHN64
LPC2132FHN64/01
LPC2134FBD64
LPC2134FBD64/01
LPC2136FBD64
LPC2136FBD64/01
LPC2138FBD64
LPC2138FBD64/01
LPC2138FHN64
LPC2138FHN64/01
Ordering information
Ordering options
All information provided in this document is subject to legal disclaimers.
Package
Name
LQFP64
LQFP64
HVQFN64 plastic thermal enhanced very thin quad flat
Flash
memory
32 kB
32 kB
64 kB
64 kB
64 kB
64 kB
128 kB
128 kB
256 kB
256 kB
512 kB
512 kB
512 kB
512 kB
Rev. 5 — 2 February 2011
RAM
8 kB
8 kB
16 kB 1
16 kB 1
16 kB 1
16 kB 1
16 kB 2
16 kB 2
32 kB 2
32 kB 2
32 kB 2
32 kB 2
32 kB 2
32 kB 2
Description
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
plastic low profile quad flat package; 64 leads;
body 10 × 10 × 1.4 mm
package; no leads; 64 terminals; body
9 × 9 × 0.85 mm
package; no leads; 64 terminals; body
9 × 9 × 0.85 mm
…continued
ADC
1
1
DAC
-
-
1
1
1
1
1
1
1
1
1
1
1
1
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
Enhanced UARTs,
ADC, Fast I/Os, and
BOD
yes
yes
yes
yes
yes
yes
yes
no
no
no
no
no
no
no
© NXP B.V. 2011. All rights reserved.
Temperature
range
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
Version
SOT314-2
SOT314-2
SOT314-2
SOT314-2
SOT804-2
SOT804-2
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