HD6417708SF60V Renesas Electronics America, HD6417708SF60V Datasheet - Page 243

IC SUPERH MPU ROMLESS 208LQFP

HD6417708SF60V

Manufacturer Part Number
HD6417708SF60V
Description
IC SUPERH MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of HD6417708SF60V

Core Processor
SH-2
Core Size
32-Bit
Speed
60MHz
Connectivity
EBI/EMI, SCI, SmartCard
Peripherals
POR, WDT
Number Of I /o
8
Program Memory Type
ROMless
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Ram Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417708SF60V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD6417708SF60V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
10.3
10.3.1
The SH7708 Seires supports both big-endian mode, in which the 0 address is the most significant
byte in the byte data, and little-endian mode, in which the 0 address is the least significant byte.
Switching between the two is designated by an external pin (MD5 pin) at the time of a power-on
reset. After a power-on reset, big-endian mode is set when MD5 is low, and little-endian mode is
set when MD5 is high.
Three data bus widths are available for normal memory (byte, word, longword) and two data bus
widths (word and longword) for DRAM and pseudo-SRAM. Only longword is available for
synchronous DRAM. For the PCMCIA interface, choose from byte and word. This means data
alignment is done by matching the device’s data width and endian. The access unit must also be
matched to the device’s bus width. This also means that when longword data is read from a byte-
width device, four read operations must be executed. In the SH7708 Series, data alignment and
conversion of data length is performed automatically between the respective interfaces.
Tables 10.6 through 10.11 show the relationship between endian, device data width, and access
unit.
Table 10.6 32-Bit External Device/Big Endian Access and Data Alignment
Operation
Address 0
byte access
Address 1
byte access
Address 2
byte access
Address 3
byte access
Address 0
word access
Address 2
word access
Address 0
longword
access
BSC Operation
Endian/Access Size and Data Alignment
D31–D24 D23–D16 D15–D8 D7–D0
Data
7–0
Data
15–8
Data
31–24
Data
7–0
Data
7–0
Data
23–16
Data Bus
Data
7–0
Data
15–8
Data
15–8
Data
7–0
Data
7–0
Data
7–0
WE3,
CASHH,
DQMUU
Asserted —
Asserted Asserted —
Asserted Asserted Asserted Asserted
WE2,
CASHL,
DQMUL
Asserted —
Strobe Signal
WE1,
CASLH,
DQMLU
Asserted —
Asserted Asserted
WE0,
CASLL,
DQMLL
Asserted
223

Related parts for HD6417708SF60V