PIC12LCE673-04I/P Microchip Technology, PIC12LCE673-04I/P Datasheet - Page 93

IC MCU OTP 1KX14 LV A/D EE 8DIP

PIC12LCE673-04I/P

Manufacturer Part Number
PIC12LCE673-04I/P
Description
IC MCU OTP 1KX14 LV A/D EE 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets

Specifications of PIC12LCE673-04I/P

Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
OTP
Eeprom Size
16 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Processor Series
PIC12LC
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Data Rom Size
128 B
Height
3.3 mm
Length
9.27 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.5 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC12LCE673-04I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
DC CHARACTERISTICS
Note 1: Data in Typical ("Typ") column is based on characterization results at 25°C. This data is for design guidance only and is not
Parm
1999 Microchip Technology Inc.
No.
*
2: This is the limit to which V
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator
4: For EXTRC osc configuration, current through R
5: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the
6: INTRC calibration value is for 4MHz nominal at 5V, 25°C.
LP Oscillator Operating
Frequency
INTRC/EXTRC Oscillator
Operating Frequency
XT Oscillator Operating
Frequency
HS Oscillator Operating
Frequency
These parameters are characterized but not tested.
tested.
type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption.
a) The test conditions for all I
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode.
formula:
Ir = V
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to V
MCLR = V
DD
Characteristic
/2R
EXT
DD
(mA) with R
; WDT disabled.
DD
EXT
can be lowered in SLEEP mode without losing RAM data.
DD
in kOhm.
measurements in active operation mode are:
F
Sym
OSC
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
Min Typ
0
0
0
EXT
is not included. The current through the resistor can be estimated by the
(1)
Max Units
200
4
10
4
(6)
MHz
MHz
MHz
kHz
–40°C
–40°C
DD
0°C
or V
All temperatures
All temperatures
All temperatures
All temperatures
SS
T
T
SS
.
T
A
A
A
, T0CKI = V
+85°C (industrial)
+125°C (extended)
+70°C (commercial)
PIC12C67X
Conditions
DD
,
DS30561B-page 93

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