LPC2420FBD208,551 NXP Semiconductors, LPC2420FBD208,551 Datasheet - Page 70

IC ARM7 MCU ROMLESS 208LQFP

LPC2420FBD208,551

Manufacturer Part Number
LPC2420FBD208,551
Description
IC ARM7 MCU ROMLESS 208LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheet

Specifications of LPC2420FBD208,551

Program Memory Type
ROMless
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
EBI/EMI, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
160
Ram Size
82K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
82 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4527
935286745551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2420FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC2420_60_5
Preliminary data sheet
Fig 26. Booting from two 8-bit memory chips
13.3 XTAL and RTC Printed Circuit Board (PCB) layout guidelines
13.4 Suggested boot memory interface solutions
A[a_b:1]
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
case of third overtone crystal usage, have a common ground plane. The external
components must also be connected to the ground plain. Loops must be made as small
as possible, in order to keep the noise coupled in via the PCB as small as possible. Also
parasitics should stay as small as possible. Values of C
smaller accordingly to the increase in parasitics of the PCB layout.
‘a_m’ and ‘a_b’ in the following figures refer to the highest order address line of the
memory chip and the highest order microcontroller’s address line used respectively.
CS1
Fig 25. Slave mode operation of the on-chip oscillator
OE
D[15:8]
BLS1
A[a_m:0]
IO[7:0]
WE
OE
CE
Rev. 05 — 24 February 2010
MEMORY
8-bit
XTAL1
LPC2xxx
C i
100 pF
D[7:0]
BLS0
002aae718
Flashless 16-bit/32-bit microcontroller
C g
A[a_m:0]
IO[7:0]
WE
CE
OE
x1
and C
LPC2420/2460
MEMORY
8-bit
002aad322
x2
x1
should be chosen
and C
© NXP B.V. 2010. All rights reserved.
x2
, and C
x3
70 of 79
in

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