ST7FLITEU05M6 STMicroelectronics, ST7FLITEU05M6 Datasheet - Page 126

• Manufacturer Part Number: ST7FLITEU05M6
• Description: MCU 8BIT SGL VOLT FLASH SO-8
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST7FLITEU05M6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 5
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Processor Series: ST7FLITEUx
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: ICC
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7FUS-PRIMER, ST7FLITE-SK/RAIS, ST7FLITU0-D/RAIS, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 5 Channel
• For Use With: 497-5858 - EVAL BOARD PLAYBACK ST7FLITE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

Package characteristics
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Table 77.
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
Symbol
P
R
of an application can be defined by the user with the formula: P
internal power (I
application.
T
Dmax
thJA
Jmax
Package thermal resistance
(junction to ambient)
Maximum junction temperature
Power dissipation
Package characteristics
DD
x V
DD
) and P
Ratings
(2)
PORT
is the port power dissipation depending on the ports used in the
(1)
DIP8
SO8
DFN8 (on 4-layer PCB)
DFN8 (on 2-layer PCB)
DIP8
SO8
DFN8 (on 4-layer PCB)
DFN8 (on 2-layer PCB)
D
D
=P
= (T
INT
J
+P
-T
A
PORT
) / R
ST7LITEU05 ST7LITEU09
thJA
where P
. The power dissipation
INT
is the chip
Value
130
106
150
300
180
500
250
82
50
°C/W
Unit
mW
°C