STR912FAW47X6 STMicroelectronics, STR912FAW47X6 Datasheet - Page 73

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STR912FAW47X6

Manufacturer Part Number
STR912FAW47X6
Description
MCU ARM9 2048KB FLASH 128LQFP
Manufacturer
STMicroelectronics
Series
STR9r
Datasheet

Specifications of STR912FAW47X6

Core Processor
ARM9
Core Size
32-Bit
Speed
96MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
2MB (2M x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
Processor Series
STR912x
Core
ARM966E-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
96 KB
Interface Type
CAN, I2C, IrDA, SSP, UART, USB
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
80
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, KSDK-STR912-PLUS, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
STR9
Device Core
ARM966E-S
Device Core Size
16/32Bit
Frequency (max)
96MHz
Total Internal Ram Size
96KB
# I/os (max)
80
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
2/3.6V
Operating Supply Voltage (min)
1.65/1.77/2.5/2.7V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
128
Package Type
LQFP
For Use With
MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-9039
STR912FAW47X6

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STR91xFAxxx
7.9.2
Table 28.
1. Data based on characterization results, not tested in production.
2. BGA and LQFP devices have similar EMI characteristics.
7.9.3
7.9.4
Table 29.
1. Data based on characterization results, not tested in production.
V
V
Symbol
ESD(HBM)
ESD(CDM)
S
Symbol
EMI
Peak level
Parameter
ESD data
EMI data
Electro magnetic interference (EMI)
Based on a simple application running on the product (toggling 2 LEDs through the I/O
ports), the product is monitored in terms of emission. This emission test is in line with the
norm SAE J 1752/3 which specifies the board and the loading of each pin.
Absolute maximum ratings (electrical sensitivity)
Based on two different tests (ESD and LU) using specific measurement methods, the
product is stressed in order to determine its performance in terms of electrical sensitivity.
Electro-static discharge (ESD)
Electro-Static Discharges (3 positive then 3 negative pulses separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts*(n+1) supply pin). This test
conforms to the JESD22-A114A/A115A standard. For more details, refer to the application
note AN1181.
Electro-static discharge voltage
(Human Body Model)
Electro-static discharge voltage
(Charged Device Model)
V
T
LQFP128 package
conforming to SAE J
1752/3
A
DDQ
=+25 °C,
= 3.3 V, V
Conditions
Ratings
DD
=1.8 V,
(2)
Doc ID 13495 Rev 6
0.1 MHz to 30 MHz
30 MHz to
130 MHz
130 MHz to 1GHz
SAE EMI Level
Frequency Band
Monitored
T
conforming to
JESD22-A114
T
conforming to
JESD22-C101
A
A
= +25°C
= +25°C
Conditions
48 MHz
24 MHz /
14
18
18
4
Class
[f
OSC
(1)
2
II
Max vs.
Electrical characteristics
/f
CPUCLK
96 MHz
Maximum
24 MHz /
value
+/-2000
1000
]
10
19
22
4
(1)
(1)
dBµV
73/102
Unit
Unit
V
-

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