MC9S08GT60ACFBE Freescale Semiconductor, MC9S08GT60ACFBE Datasheet - Page 18

• Manufacturer Part Number: MC9S08GT60ACFBE
• Description: IC MCU 60K FLASH 4K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT60ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 36
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8/2.08V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 2
• Operating Supply Voltage: 0 V to 1.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Chapter 1 Device Overview
1.2.2
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On-chip in-circuit programmable flash memory:
— Fully read/write functional across voltage and temperature ranges
— Block protection and security options
— (see
On-chip random-access memory (RAM) (see
8-channel, 10-bit analog-to-digital converter (ATD)
Two serial communications interface modules (SCI)
Serial peripheral interface module (SPI)
Multiple clock source options:
— Internally generated clock with ±0.2% trimming resolution and ±0.5% deviation across voltage
— Crystal
— Resonator
— External clock
Inter-integrated circuit bus module to operate up to 100 kbps (IIC)
One 3-channel and one 5-channel 16-bit timer/pulse width modulator (TPM) modules with
selectable input capture, output compare, and edge-aligned PWM capability on each channel. Each
timer module may be configured for buffered, centered PWM (CPWM) on all channels (TPMx).
8-pin keyboard interrupt module (KBI)
16 high-current pins (limited by package dissipation)
Software selectable pullups on ports when used as input. Selection is on an individual port bit basis.
During output mode, pullups are disengaged.
Internal pullup on RESET and IRQ pin to reduce customer system cost
Up to 56 general-purpose input/output (I/O) pins, depending on package selection
64-pin low-profile quad flat package (LQFP) — MC9S08GBxxA
48-pin quad flat package, no lead (QFN) — MC9S08GTxxA
44-pin quad flat package (QFP) — MC9S08GTxxA
42-pin skinny dual in-line package (SDIP) — MC9S08GTxxA
Features of MC9S08GBxxA/GTxxA Series of MCUs
Table 1-1
for device-specific information)
MC9S08GB60A Data Sheet, Rev. 2
Table 1-1
for device specific information)
Freescale Semiconductor