KIT33912G5DGEVME Freescale Semiconductor, KIT33912G5DGEVME Datasheet - Page 53

• Manufacturer Part Number: KIT33912G5DGEVME
• Description: Power Management Modules & Development Tools 33912G5 LIN SBC KIT
• Manufacturer: Freescale Semiconductor
• Type: Motor / Motion Controllers & Driversr

Specifications of KIT33912G5DGEVME

• Interface Type: SPI
• Product: Power Management Modules
• Silicon Manufacturer: Freescale
• Silicon Core Number: MC33912
• Kit Application Type: Interface
• Application Sub Type: LIN System
• Kit Contents: Board, CD, Misc Cable
• Rohs Compliant: Yes
• For Use With/related Products: MC33912
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 34. Maximum Ratings (continued)
permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
THERMAL RATINGS
Notes
Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
Thermal Resistance, Junction to Ambient
Natural Convection, Single Layer board (1s)
Natural Convection, Four Layer board (2s2p)
Thermal Resistance, Junction to Case
Peak Package Reflow Temperature During Reflow
81.
82.
83.
84.
85.
86.
87.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
(81)
Ratings
(85)
(82), (83)
(82), (84)
(86), (87)
33912
34912
Symbol
T
T
R
R
PPRT
T
T
STG
θJC
θJA
A
J
ELECTRICAL CHARACTERISTICS
-40 to 125
-40 to 150
-55 to 150
-40 to 85
Note 87
Value
85
56
23
MAXIMUM RATINGS
°C/W
°C/W
Unit
°C
°C
°C
°C
33912
53