SPC5604PEF0MLQ6 Freescale Semiconductor, SPC5604PEF0MLQ6 Datasheet - Page 2

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SPC5604PEF0MLQ6

Manufacturer Part Number
SPC5604PEF0MLQ6
Description
IC MCU 32BIT 512KB FLASH 144LQFP
Manufacturer
Freescale Semiconductor
Series
MPC56xx Qorivvar
Datasheet

Specifications of SPC5604PEF0MLQ6

Core Processor
e200z0h
Core Size
32-Bit
Speed
64MHz
Connectivity
CAN, FlexRay, LIN, SPI, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
108
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
64K x 8
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 30x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SPC5604PEF0MLQ6
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
SPC5604PEF0MLQ6
Manufacturer:
FREESCALE
Quantity:
20 000
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Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1
1.2
1.3
1.4
1.5
Package pinouts and signal descriptions . . . . . . . . . . . . . . . .20
2.1
2.2
Document overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
1.5.1 High performance e200z0 core processor. . . . . .7
1.5.2 Crossbar switch (XBAR) . . . . . . . . . . . . . . . . . . .8
1.5.3 Enhanced direct memory access (eDMA) . . . . . .8
1.5.4 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . .8
1.5.5 Static random access memory (SRAM) . . . . . . .9
1.5.6 Interrupt controller (INTC) . . . . . . . . . . . . . . . . . .9
1.5.7 System status and configuration module (SSCM)10
1.5.8 System clocks and clock generation . . . . . . . . .10
1.5.9 Frequency-modulated phase-locked loop
(FMPLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
1.5.10 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . . .11
1.5.11 Internal RC oscillator . . . . . . . . . . . . . . . . . . . . .11
1.5.12 Periodic interrupt timer (PIT) . . . . . . . . . . . . . . .11
1.5.13 System timer module (STM) . . . . . . . . . . . . . . .11
1.5.14 Software watchdog timer (SWT) . . . . . . . . . . . .11
1.5.15 Fault collection unit (FCU) . . . . . . . . . . . . . . . . .12
1.5.16 System integration unit – Lite (SIUL) . . . . . . . . .12
1.5.17 Boot and censorship . . . . . . . . . . . . . . . . . . . . .12
1.5.18 Error correction status module (ECSM). . . . . . .13
1.5.19 Peripheral bridge (PBRIDGE) . . . . . . . . . . . . . .13
1.5.20 Controller area network (FlexCAN) . . . . . . . . . .13
1.5.21 Safety port (FlexCAN) . . . . . . . . . . . . . . . . . . . .14
1.5.22 FlexRay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
1.5.23 Serial communication interface module (LINFlex)15
1.5.24 Deserial serial peripheral interface (DSPI) . . . .15
1.5.25 Pulse width modulator (FlexPWM) . . . . . . . . . .16
1.5.26 eTimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1.5.27 Analog-to-digital converter (ADC) module . . . . .17
1.5.28 Cross triggering unit (CTU) . . . . . . . . . . . . . . . .18
1.5.29 Nexus development interface (NDI) . . . . . . . . . .18
1.5.30 Cyclic redundancy check (CRC) . . . . . . . . . . . .19
1.5.31 IEEE 1149.1 JTAG controller . . . . . . . . . . . . . . .19
1.5.32 On-chip voltage regulator (VREG). . . . . . . . . . .19
Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
2.2.1 Power supply and reference voltage pins . . . . .21
2.2.2 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
2.2.3 Pin muxing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
MPC5604P Microcontroller Data Sheet, Rev. 7
Table of Contents
3
4
5
Appendix AAbbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . 53
3.11 Main oscillator electrical characteristics . . . . . . . . . . . 62
3.12 FMPLL electrical characteristics . . . . . . . . . . . . . . . . . 63
3.13 16 MHz RC oscillator electrical characteristics . . . . . . 64
3.14 Analog-to-digital converter (ADC)
electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
3.15 Flash memory electrical characteristics . . . . . . . . . . . 70
3.16 AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
3.17 AC timing characteristics . . . . . . . . . . . . . . . . . . . . . . . 73
Package characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
4.1
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Parameter classification. . . . . . . . . . . . . . . . . . . . . . . . 38
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . 39
Recommended operating conditions . . . . . . . . . . . . . . 41
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 45
3.5.1 Package thermal characteristics . . . . . . . . . . . 45
3.5.2 General notes for specifications
at maximum junction temperature . . . . . . . . . . . . . . . . 46
Electromagnetic interference (EMI) characteristics . . . 48
Electrostatic discharge (ESD) characteristics . . . . . . . 48
Power management electrical characteristics . . . . . . . 48
3.8.1 Voltage regulator electrical characteristics . . . . 48
3.8.2 Voltage monitor electrical characteristics . . . . . 51
Power up/down sequencing. . . . . . . . . . . . . . . . . . . . . 51
3.10.1 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . 53
3.10.2 DC electrical characteristics (5 V) . . . . . . . . . . 54
3.10.3 DC electrical characteristics (3.3 V) . . . . . . . . . 55
3.10.4 Input DC electrical characteristics definition . . 57
3.10.5 I/O pad current specification . . . . . . . . . . . . . . 58
3.14.1 Input impedance and ADC accuracy . . . . . . . . 65
3.14.2 ADC conversion characteristics . . . . . . . . . . . . 69
3.16.1 Pad AC specifications. . . . . . . . . . . . . . . . . . . . 71
3.17.1 RESET pin characteristics . . . . . . . . . . . . . . . . 73
3.17.2 IEEE 1149.1 interface timing . . . . . . . . . . . . . . 75
3.17.3 Nexus timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 77
3.17.4 External interrupt timing (IRQ pin) . . . . . . . . . . 79
3.17.5 DSPI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . 86
4.1.1 144 LQFP mechanical outline drawing. . . . . . . 86
4.1.2 100 LQFP mechanical outline drawing. . . . . . . 88
Freescale Semiconductor

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