AM29LV800DB-70ED Spansion Inc., AM29LV800DB-70ED Datasheet - Page 10

no-image

AM29LV800DB-70ED

Manufacturer Part Number
AM29LV800DB-70ED
Description
Flash Memory IC
Manufacturer
Spansion Inc.
Series
AM29r

Specifications of AM29LV800DB-70ED

Memory Size
8Mbit
Package/case
48-TSOP
Supply Voltage Max
3V
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
Yes
Access Time, Tacc
70nS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AM29LV800DB-70ED
Manufacturer:
SPANSION
Quantity:
472
Ordering Information
Standard Products
AMD standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the elements below.
8
Am29LV800D
T
DEVICE NUMBER/DESCRIPTION
Am29LV800D
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
-70
E
Valid Combinations for TSOP and SO Packages
AM29LV800DT-70,
AM29LV800DB-70
AM29LV800DT-90,
AM29LV800DB-90
AM29LV800DT-120,
AM29LV800DB-120
C
TEMPERATURE RANGE
C
D
I
F
PACKAGE TYPE
E
F
S
WB
WC
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
P R E L I M I N A R Y
=
=
=
=
=
=
=
=
=
=
=
=
Commercial (0°C to +70°C)
Commercial (0
Industrial (–40
Industrial (–40
48-Pin Thin Small Outline Package (TSOP) Standard Pinout
(TS 048)
48-Pin Thin Small Outline Package (TSOP) Reverse Pinout
(TSR048)
44-Pin Small Outline Package (SO 044)
48-Ball Fine Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 6 x 9 mm package (FBB048)
48-Ball Fine Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 6.15 x 8.15 mm package (VBK 048)
Top sector
Bottom sector
Am29LV800D
EC, EI, ED, EF, FC, FD, FF, FI,
EC, EI, ED,EF,FD, FF,FC,
FI,SD, SFSC, SI
SC, SD, SF, SI
°
°
°
C to +70
C to +85
C to +85
°
°
°
C) with Pb-Free Package
C)
C) with Pb-Free Package
Am29LV800D_00_A4_E January 21, 2005

Related parts for AM29LV800DB-70ED