Audio Amplifiers 2X15W BTL CLASS D AMP+VOLCTRL

TDA8932T

Manufacturer Part NumberTDA8932T
DescriptionAudio Amplifiers 2X15W BTL CLASS D AMP+VOLCTRL
ManufacturerNXP Semiconductors
TDA8932T datasheet
 


Specifications of TDA8932T

ProductClass-DOutput Power50 W
Available Set Gain36 dBCommon Mode Rejection Ratio (min)56 dB
Thd Plus Noise0.015 %Operating Supply Voltage22 V
Maximum Power Dissipation5000 mWMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMTAudio Load Resistance8 Ohms
Dual Supply Voltage+/- 11 VInput Signal TypeDifferential
Minimum Operating Temperature- 40 COutput Signal TypeDifferential, Single
Supply TypeSingle or DualSupply Voltage (max)36 V
Supply Voltage (min)10 VOutput Type1-Channel Mono or 2-Channel Stereo
Package / CaseSOIC-32Lead Free Status / RoHS StatusLead free / RoHS Compliant
Other namesTDA8932T/N1,112  
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NXP Semiconductors
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16
Table 16.
Package thickness (mm)
< 2.5
2.5
Table 17.
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
TDA8932_2
Preliminary data sheet
and
17
SnPb eutectic process (from J-STD-020C)
Package reflow temperature ( C)
3
Volume (mm
)
< 350
235
220
Lead-free process (from J-STD-020C)
Package reflow temperature ( C)
3
Volume (mm
)
< 350
260
260
250
Figure
33.
Rev. 02 — 12 December 2006
TDA8932
Class-D audio amplifier
Figure
33) than a PbSn process, thus
350
220
220
350 to 2000
> 2000
260
260
250
245
245
245
© NXP B.V. 2006. All rights reserved.
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