MT48LC16M16A2P-75 IT:D Micron Technology Inc, MT48LC16M16A2P-75 IT:D Datasheet - Page 15

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MT48LC16M16A2P-75 IT:D

Manufacturer Part Number
MT48LC16M16A2P-75 IT:D
Description
DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC16M16A2P-75 IT:D

Density
256 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
-40 to 85 °C
Organization
16Mx16
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
Package Dimensions
Figure 7: 54-Pin Plastic TSOP (400 mil)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
0.15
2X R 0.75
2X R 1.00
PIN #1 ID
+0.03
-0.02
Notes:
10.16 ±0.08
11.76 ±0.20
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. 2X means the notch is present in two locations (both ends of the device).
0.25mm per side.
2.80
2X 0.10
2X 0.71
SEE DETAIL A
22.22 ±.08
15
0.10
+0.10
-0.05
Micron Technology, Inc. reserves the right to change products or specifications without notice.
PLATED LEAD FINISH: 90% Sn, 10% Pb OR 100%Sn
PLASTIC PACKAGE MATERIAL: EPOXY NOVOLAC
PACKAGE WIDTH AND LENGTH DO NOT
INCLUDE MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE.
1.2 MAX
0.10
0.375 ±0.075 TYP
0.80 TYP
(FOR REFERENCE
ONLY)
0.50 ±0.10
256Mb: x4, x8, x16 SDRAM
Package Dimensions
DETAIL A
© 1999 Micron Technology, Inc. All rights reserved.
GAGE PLANE
0.80
0.25

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