MT48LC16M16A2P-75 IT:D Micron Technology Inc, MT48LC16M16A2P-75 IT:D Datasheet - Page 17

• Manufacturer Part Number: MT48LC16M16A2P-75 IT:D
• Description: DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC16M16A2P-75 IT:D

• Density: 256 Mb
• Maximum Clock Rate: 133 MHz
• Package: 54TSOP-II
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: -40 to 85 °C
• Organization: 16Mx16
• Address Bus: 15b
• Access Time (max): 6/5.4ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 135mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Figure 9: 54-Ball VFBGA "FG" (8mm x 14mm) (x16)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
SEATING PLANE
54X Ø0.45
6.40
0.10 C
3.20 ±0.05
BALL A9
Notes:
C
0.65 ±0.05
3.20 ±0.05
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.065mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
0.80 TYP
BALL A1
0.80 TYP
7.00 ±0.05
BALL A1 ID
17
14.00 ±0.10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.00 MAX
256Mb: x4, x8, x16 SDRAM
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø 0.40
Package Dimensions
© 1999 Micron Technology, Inc. All rights reserved.
BALL A1 ID