MT48LC16M16A2P-75 IT:D Micron Technology Inc, MT48LC16M16A2P-75 IT:D Datasheet - Page 2

• Manufacturer Part Number: MT48LC16M16A2P-75 IT:D
• Description: DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC16M16A2P-75 IT:D

• Density: 256 Mb
• Maximum Clock Rate: 133 MHz
• Package: 54TSOP-II
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: -40 to 85 °C
• Organization: 16Mx16
• Address Bus: 15b
• Access Time (max): 6/5.4ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 135mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Table 3: 256Mb SDR Part Numbering
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
Note:
1. Actual FBGA part marking is shown in Package Dimensions (page 15).
MT48LC16M16A2BG
MT48LC16M16A2TG
MT48LC16M16A2FG
MT48LC64M4A2BB
MT48LC32M8A2BB
MT48LC64M4A2FB
MT48LC32M8A2FB
MT48LC64M4A2TG
MT48LC32M8A2TG
MT48LC16M16A2P
MT48LC64M4A2P
MT48LC32M8A2P
Part Numbers
1
1
1
1
Architecture
2
16 Meg x 16
16 Meg x 16
16 Meg x 16
16 Meg x 16
64 Meg x 4
64 Meg x 4
64 Meg x 4
64 Meg x 4
32 Meg x 8
32 Meg x 8
32 Meg x 8
32 Meg x 8
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 SDRAM
© 1999 Micron Technology, Inc. All rights reserved.
54-pin TSOP II
54-pin TSOP II
54-pin TSOP II
54-pin TSOP II
54-pin TSOP II
54-pin TSOP II
60-ball FBGA
60-ball FBGA
60-ball FBGA
60-ball FBGA
54-ball FBGA
54-ball FBGA
Package
Features