MT48LC16M16A2P-75 IT:D Micron Technology Inc, MT48LC16M16A2P-75 IT:D Datasheet - Page 4

• Manufacturer Part Number: MT48LC16M16A2P-75 IT:D
• Description: DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC16M16A2P-75 IT:D

• Density: 256 Mb
• Maximum Clock Rate: 133 MHz
• Package: 54TSOP-II
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: -40 to 85 °C
• Organization: 16Mx16
• Address Bus: 15b
• Access Time (max): 6/5.4ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 135mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

List of Tables
Table 1: Address Table .................................................................................................................................... 1
Table 2: Key Timing Parameters ...................................................................................................................... 1
Table 3: 256Mb SDR Part Numbering ............................................................................................................... 2
Table 4: Pin and Ball Descriptions .................................................................................................................. 14
Table 5: Temperature Limits .......................................................................................................................... 18
Table 6: Thermal Impedance Simulated Values .............................................................................................. 19
Table 7: Absolute Maximum Ratings .............................................................................................................. 21
Table 8: DC Electrical Characteristics and Operating Conditions ..................................................................... 21
Table 9: Capacitance ..................................................................................................................................... 22
Table 10: I
Table 11: I
Table 12: Electrical Characteristics and Recommended AC Operating Conditions (-6A) ................................... 25
Table 13: Electrical Characteristics and Recommended AC Operating Conditions (-7E, -75) ............................. 26
Table 14: AC Functional Characteristics (-6A) ................................................................................................. 27
Table 15: AC Functional Characteristics (-7E, -75) .......................................................................................... 28
Table 16: Truth Table – Commands and DQM Operation ................................................................................ 31
Table 17: Truth Table – Current State Bank n, Command to Bank n ................................................................. 37
Table 18: Truth Table – Current State Bank n, Command to Bank m ................................................................ 39
Table 19: Truth Table – CKE .......................................................................................................................... 41
Table 20: Burst Definition Table .................................................................................................................... 48
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
DD
DD
Specifications and Conditions (-6A) ........................................................................................... 23
Specifications and Conditions (-7E, -75) .................................................................................... 23
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 SDRAM
© 1999 Micron Technology, Inc. All rights reserved.