AD5383BST-3 Analog Devices Inc, AD5383BST-3 Datasheet - Page 33

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AD5383BST-3

Manufacturer Part Number
AD5383BST-3
Description
IC DAC 12BIT 32CH 3V 100-LQFP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD5383BST-3

Design Resources
32 Channels of Programmable Voltage with Excellent Temperature Drift Performance Using AD5383 (CN0014) AD5383 Channel Monitor Function (CN0015)
Settling Time
6µs
Number Of Bits
12
Data Interface
Serial, Parallel
Number Of Converters
32
Voltage Supply Source
Single Supply
Power Dissipation (max)
39mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
APPLICATION INFORMATION
POWER SUPPLY DECOUPLING
In any circuit where accuracy is important, careful considera-
tion of the power supply and ground return layout helps to
ensure the rated performance. The printed circuit board on
which the AD5383 is mounted should be designed so that the
analog and digital sections are separated and confined to
certain areas of the board. If the AD5383 is in a system where
multiple devices require an AGND-to-DGND connection, the
connection should be made at one point only, a star ground
point established as close to the device as possible.
For supplies with multiple pins (AV
be tied together. The AD5383 should have ample supply bypas-
sing of 10 μF in parallel with 0.1 μF on each supply, located as
close to the package as possible and ideally right up against the
device. The 10 μF capacitors are the tantalum bead type. The
0.1 μF capacitor should have low effective series resistance
(ESR) and effective series inductance (ESI), like the common
ceramic types that provide a low impedance path to ground at
high frequencies, to handle transient currents due to internal
logic switching.
The power supply lines of the AD5383 should use as large a
trace as possible to provide low impedance paths and reduce the
effects of glitches on the power supply line. Fast switching
signals such as clocks should be shielded with digital ground to
avoid radiating noise to other parts of the board, and should
never be run near the reference inputs. A ground line routed
between the DIN and SCLK lines will help reduce crosstalk
between them (this is not required on a multilayer board
because there will be a separate ground plane, but separating
the lines will help). It is essential to minimize noise on the V
and REFIN lines.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feedthrough through the
board. A micro-strip technique is by far the best, but is not
always possible with a double-sided board. In this technique,
the component side of the board is dedicated to the ground
plane while signal traces are placed on the solder side.
TYPICAL CONFIGURATION CIRCUIT
Figure 39 shows a typical configuration for the AD5383-5 when
configured for use with an external reference. In the circuit
shown, all AGND, SIGNAL_GND, and DAC_GND pins are
tied together to a common AGND. AGND and DGND are
connected together at the AD5383 device. On power-up, the
AD5383 defaults to external reference operation. All AV
are connected together and driven from the same 5 V source. It
is recommended to decouple close to the device with a 0.1 μF
ceramic and a 10 μF tantalum capacitor. In this application, the
reference for the AD5383-5 is provided externally from either
DD
, DV
DD
), these pins should
DD
lines
IN
Rev. B | Page 33 of 40
an ADR421 or ADR431 2.5 V reference. Suitable external
references for the AD5383-3 include the ADR280 1.2 V
reference. The reference should be decoupled at the
REFOUT/REFIN pin of the device with a 0.1 μF capacitor.
Figure 40 shows a typical configuration when using the internal
reference. On power-up, the AD5383 defaults to an external
reference; therefore, the internal reference needs to be
configured and turned on via a write to the AD5383 control
register. Control Register Bit CR10 allows the user to choose the
reference value; Bit CR 8 is used to select the internal reference.
It is recommended to use the 2.5 V reference when AV
and the 1.25 V reference when AV
Digital connections have been omitted for clarity. The AD5383
contains an internal power-on reset circuit with a 10 ms
brownout time. If the power supply ramp rate exceeds 10 ms,
the user should reset the AD5383 as part of the initialization
process to ensure the calibration data gets loaded correctly into
the device.
ADR431/
ADR421
0.1μF
Figure 39. Typical Configuration with External Reference
Figure 40. Typical Configuration with Internal Reference
0.1 μ F
REFOUT/REFIN
REFGND
REFOUT/REFIN
REFGND
AV
AV
GND
DAC
DD
DD
0.1μF
AV
AV
10μF
DAC
GND
SIGNAL
DD
DD
GND
AD5383
0.1 μ F
10 μ F
SIGNAL
GND
AD5383-5
AGND
DD
= 3 V.
AGND
DGND
DV
DV
DD
DD
V
V
OUT
DGND
0.1μF
DV
DV
OUT
DD
DD
31
V
0
V
OUT
0.1 μ F
OUT
31
0
AD5383
DD
= 5 V,

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