UPD75P3216GT Renesas Electronics America, UPD75P3216GT Datasheet
UPD75P3216GT
Specifications of UPD75P3216GT
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UPD75P3216GT Summary of contents
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To our customers, Old Company Name in Catalogs and Other Documents st On April 1 , 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the ...
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All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm ...
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SINGLE-CHIP MICROCONTROLLER The µ PD75P3216 replaces the µ PD753208’s internal mask ROM with a one-time PROM, and features expanded ROM capacity. Because the µ PD75P3216 supports programming by users suitable for use in prototype testing for system ...
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FUNCTION OUTLINE Parameter • 0.95, 1.91, 3.81, 15.3 µ 4.19-MHz operation with system clock) Instruction execution time • 0.67, 1.33, 2.67, 10.7 µ 6.0-MHz operation with system clock) 16384 × 8 bits Internal memory PROM 512 ...
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PIN CONFIGURATION (Top View) .................................................................................................... 4 2. BLOCK DIAGRAM ............................................................................................................................... 5 3. PIN FUNCTIONS .................................................................................................................................. 6 3.1 Port Pins ...................................................................................................................................................... 6 3.2 Non-port Pins .............................................................................................................................................. 7 3.3 Equivalent Circuits for Pins ...................................................................................................................... 8 3.4 Recommended Connection of Unused Pins ...
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PIN CONFIGURATION (Top View) • 48-pin plastic shrink SOP (375 mil, 0.65-mm pitch) µ PD75P3216GT µ PD75P3216GT-A COM0 COM1 COM2 COM3 BIAS V LC0 V LC1 V LC2 P30/LCDCL/MD0 P31/SYNC/MD1 P32/MD2 P33/MD3 V SS P50/D4 P51/D5 P52/D6 P53/D7 P60/KR0/D0 ...
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BLOCK DIAGRAM WATCH BUZ/P23 TIMER INTW f LCD BASIC INTERVAL TIMER/ WATCHDOG TIMER INTBT 8-BIT TI0/P13 TIMER/EVENT PTO0/P20 COUNTER #0 INTT0 TOUT INTT1 8-BIT TIMER CASCADED PTO1/P21 COUNTER #1 16-BIT TIMER TOUT 8-BIT COUNTER TIMER PTO2/ COUNTER #2 PCL/P22 ...
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PIN FUNCTIONS 3.1 Port Pins Pin Name I/O Shared by P00 Input INT4 P01 I/O SCK P02 I/O SO/SB0 P03 I/O SI/SB1 P10 Input INT0 P13 TI0 P20 I/O PTO0 P21 PTO1 P22 PCL/PTO2 P23 BUZ P30 I/O LCDCL/MD0 ...
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Non-port Pins Pin Name I/O Shared by TI0 Input P13 PTO0 Output P20 PTO1 P21 PTO2 P22/PCL PCL P22/PTO2 BUZ P23 SCK I/O P01 SO/SB0 P02 SI/SB1 P03 INT4 Input P00 INT0 Input P10 KR0 to KR3 Input P60/D0-P63/D3 ...
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Equivalent Circuits for Pins The equivalent circuits for the µ PD75P3216’s pins are shown in abbreviated form below. TYPE P-ch IN N-ch CMOS standard input buffer TYPE B IN Schmitt trigger input with hysteresis characteristics. TYPE ...
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TYPE F-B P.U.R. enable Output V DD disable (P) P-ch Data Output N-ch disable Output disable (N) P.U.R. : Pull-Up Resistor TYPE G-A V LC0 V LC1 P-ch N-ch SEG data N-ch V LC2 N-ch TYPE G-B V LC0 V ...
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Recommended Connection of Unused Pins Pin P00/INT4 P01/SCK P02/SO/SB0 P03/SI/SB1 P10/INT0 P13/TI0 P20/PTO0 P21/PTO1 P22/PTO2/PCL P23/BUZ P30/MD0/LCDCL P31/MD1/SYNC P32/MD2 P33/MD3 P50/D4 to P53/D7 P60/KR0/D0 to P63/KR3/D3 Input status : connect to Vss or V S12 to S15 COM0 to ...
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Mk I AND Mk II MODE SELECTION FUNCTION Setting a stack bank selection (SBS) register for the µ PD75P3216 enables the program memory to be switched between Mk I mode and Mk II mode. This function is applicable when ...
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Setting of Stack Bank Selection (SBS) Register Use the stack bank selection register to switch between Mk I mode and Mk II mode. Figure 4-1 shows the format for doing this. The stack bank selection register is set using ...
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DIFFERENCES BETWEEN µ PD75P3216 AND µ PD753204, 753206, AND 753208 The µ PD75P3216 replaces the internal mask ROM in the µ PD753204, 753206, and 753208 with a one-time PROM and features expanded ROM capacity. The µ PD75P3216’ ...
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MEMORY CONFIGURATION 0000H MBE RBE Internal reset start address (upper 6 bits) Internal reset start address (lower 8 bits) 0002H MBE RBE INTBT/INT4 start address (upper 6 bits) INTBT/INT4 start address (lower 8 bits) 0004H MBE ...
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General-purpose register area Stack area Note Data area static RAM (512 × 4) Display data memory (12 × 4) Peripheral hardware area Note Memory bank can be selected as the stack area. Figure 6-2. Data Memory Map ...
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INSTRUCTION SET (1) Representation and coding formats for operands In the instruction’s operand area, use the following coding format to describe operands corresponding to the instruction’s operand representations (for further description, refer to RA75X Assembler Package User’s Manual –Language ...
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Operation legend register; 4-bit accumulator register register register register register register register XA : Register ...
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Description of symbols used in addressing area MB = MBE • MBS *1 MBS = MBE = (000H to 07FH (F80H to FFFH) *3 ...
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Instruction Mnemonic Operand Group Transfer MOV A, #n4 reg1, #n4 XA, #n8 HL, #n8 rp2, #n8 A, @HL A, @HL+ A, @HL– A, @rpa1 XA, @HL @HL, A @HL mem XA, mem mem, A mem reg ...
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Instruction Mnemonic Operand Group Bit transfer MOV1 CY, fmem.bit CY, pmem.@L CY, @H+mem.bit fmem.bit, CY pmem.@L, CY @H+mem.bit, CY Arithmetic ADDS A, #n4 XA, #n8 A, @HL XA, rp’ rp’1, XA ADDC A, @HL XA, rp’ rp’1, XA SUBS A, ...
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Instruction Mnemonic Operand Group Comparison SKE reg, #n4 @HL, #n4 A, @HL XA, @HL A, reg XA, rp’ Carry flag SET1 CY manipulation CLR1 CY SKT CY NOT1 CY Memory bit SET1 mem.bit manipulation fmem.bit pmem.@L @H+mem.bit CLR1 mem.bit fmem.bit ...
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Instruction Mnemonic Operand Group Note Branch BR addr addr1 !addr $addr $addr1 PCDE PCXA BCDE BCXA Note BRA !addr1 BRCB !caddr Note Shaded areas indicate support for Mk II mode only. Other areas indicate support for Mk I mode only. ...
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Instruction Mnemonic Operand Group Note Subroutine CALLA !addr1 stack control Note CALL !addr Note CALLF !faddr Note RET Note RETS Note RETI PUSH rp BS POP rp BS Note Shaded areas indicate support for Mk II mode only. Other areas ...
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Instruction Mnemonic Operand Group Interrupt EI control IEXXX DI IEXXX Note 1 I PORTn XA, PORTn Note 1 OUT PORTn, A PORTn, XA CPU control HALT STOP NOP Special SEL RBn MBn GETI Note 2, 3 taddr Notes ...
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ONE-TIME PROM (PROGRAM MEMORY) WRITE AND VERIFY The program memory contained in the µ PD75P3216 is a 16384 × 8-bit one-time PROM that can be electrically written one time only. The pins listed in the table below are used ...
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Program Memory Write Procedure Program memory can be written at high speed using the following procedure. (1) Pull down unused pins to Vss through resistors. Set the X1 pin low. (2) Supply the V and V ...
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Program Memory Read Procedure The µ PD75P3216 can read program memory contents using the following procedure. (1) Pull down unused pins to V through resistors. Set the X1 pin low. SS (2) Supply the V and ...
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One-time PROM Screening Due to its structure, the one-time PROM cannot be fully tested before shipment by NEC Electronics. Therefore, NEC Electronics recommends that after the required data is written and the PROM is stored under the temperature and ...
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ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS (T A Parameter Symbol Supply voltage V DD PROM supply voltage V PP Input voltage V Except port Port 5 I2 Output voltage V O Output current, high I Per pin ...
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SYSTEM CLOCK OSCILLATOR CHARACTERISTICS (T Resonator Recommended Constant Ceramic X2 X1 resonator Crystal X2 X1 resonator External clock X1 X2 Notes 1. The oscillator frequency and X1 input frequency indicate characteristics of ...
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DC CHARACTERISTICS (T = –40 to +85 ˚ Parameter Symbol Output current, low I Per pin OL Total for all pins Input voltage, high V Ports IH1 V Ports RESET IH2 ...
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DC CHARACTERISTICS (T = –40 to +85 ˚ Parameter Symbol LCD drive voltage V VAC0 = 0 LCD VAC0 = 1 VAC current I VAC0 = 1, V VAC lo = ±1 µ A LCD output voltage V ...
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AC CHARACTERISTICS (T = –40 to +85 ˚ Parameter Symbol CPU clock cycle 2 Note 1 time TI0 input frequency 2 TI0 ...
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SERIAL TRANSFER OPERATION 2-Wire and 3-Wire Serial I/O Mode (SCK...Internal clock output): (T Parameter Symbol SCK cycle time t V KCY1 DD SCK high/low-level KL1 KH1 DD width SI Note 1 setup time t V SIK1 ...
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SBI Mode (SCK...Internal clock output (master)): (T Parameter Symbol SCK cycle time t V KCY3 DD SCK high/low-level KL3 KH3 DD width SB0, 1 setup time t V SIK3 DD (to SCK↑) SB0, 1 hold time ...
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AC Timing Test Point (Excluding X1 Input) V (MIN (MAX (MIN (MAX.) OL Clock Timing X1 Input TI0 Timing TI0 36 V (MIN (MAX (MIN (MAX.) OL 1/f ...
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Serial Transfer Timing 3-wire serial I/O mode SCK SI t KSO1 2-wire serial I/O mode SCK SB0 KSO1 KCY1 KL1, 2 KH1 SIK1, 2 KSI1, 2 Input Data ...
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Serial Transfer Timing Bus release signal transfer SCK t t KSB SBL SB0, 1 Command signal transfer SCK t KSB SB0, 1 Interrupt input timing INTP0, 4 KR0 to 3 RESET input timing RESET 38 t KCY3 ...
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DATA MEMORY STOP MODE LOW SUPPLY VOLTAGE DATA RETENTION CHARACTERISTICS Parameter Symbol Release signal set time t SREL Oscillation stabilization t Release by RESET WAIT wait time Note 1 Release by interrupt Notes 1. The oscillation stabillization wait time is ...
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DC Programming Characteristics (T Parameter Symbol Input voltage, high V IH1 V IH2 Input voltage, low V IL1 V IL2 Input leakage current I LI Output voltage, high V OH Output voltage, low supply current I DD ...
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Program Memory Write Timing t VPS VDS D0/P60/KR0- D3/P63/KR3 Data input D4/P50- D7/P53 MD0/P30 t PW MD1/P31 t t ...
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CHARACTERISTIC CURVE (REFERENCE VALUE) 10 5.0 1.0 0.5 0.1 0.05 0.01 0.005 0.001 (System clock : 6.0 MHz Crystal resonator PCC = 0011 PCC = 0010 PCC = 0001 PCC ...
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5.0 1.0 0.5 0.1 0.05 0.01 0.005 0.001 Data Sheet U10241EJ1V1DS (System clock : 4.19 MHz Crystal resonator) PCC = 0011 PCC = 0010 PCC = 0001 PCC = 0000 HALT ...
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PACKAGE DRAWINGS 48 PIN PLASTIC SHRINK SOP (375 mil NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition detail ...
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RECOMMENDED SOLDERING CONDITIONS The µ PD75P3216 should be soldered and mounted under the following recommended conditions. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Table 12-1. Surface Mounting Type Soldering Conditions (1) µ PD75P3216GT: 48-pin ...
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APPENDIX A. µ PD753108, 753208, AND 75P3216 FUNCTIONAL LIST Parameter Program memory Data memory CPU • 0.95, 1.91, 3.81, 15.3 µ 4.19-MHz operation) Instruction When main system • 0.67, 1.33, 2.67, 10.7 µ 6.0-MHz operation) execution ...
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Parameter Test input External: 1, internal: 1 Operation supply voltage V = 1 Operating ambient temperature T = –40 to +85°C A Package • 64-pin plastic QFP (14 × 14 mm) • 64-pin plastic QFP (12 ...
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APPENDIX B. DEVELOPMENT TOOLS The following development tools have been provided for system development using the µ PD75P3216. In the 75XL series, relocatable assemblers common to the series can be used in combination with the device files for each product ...
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PROM Write Tools Hardware PG-1500 This is a PROM programmer that can program single-chip microcomputer with PROM in stand alone mode or under control of host machine when connected with supplied accessory board and optional programmer adapter. It can also ...
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Debugging Tools In-circuit emulators (IE-75000-R and IE-75001-R) are provided as program debugging tools for the µ PD75P3216. Various system configurations using these in-circuit emulators are listed below. Note 1 Hardware IE-75000-R The IE-75000 in-circuit emulator to be used ...
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OS for IBM PCs The following operating systems for the IBM PC are supported. PC DOS MS-DOS IBM DOS Note Only English version is supported. Caution Ver. 5.0 or later include a task swapping function, but this software is not ...
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APPENDIX C. RELATED DOCUMENTS Some of the related documents are preliminary but are not marked as such. Device related documents Document Name µ PD753204, 753206, 753208 preliminary product information µ PD75P3216 data sheet µ PD753208 user’s manual 75XL series selection ...
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NOTES FOR CMOS DEVICES 1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V malfunction. Take care ...
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Regional Information Some information contained in this document may vary from country to country. Before using any NEC Electronics product in your application, pIease contact the NEC Electronics office in your country to obtain a list of authorized representatives and ...
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MS-DOS is a trademark of Microsoft Corporation. IBM DOS, PC/AT, and PC DOS are trademarks of IBM Corporation. These commodities, technology or software, must be exported in accordance with the export administration regulations of the exporting country. Diversion contrary to ...