UPD75P3216GT Renesas Electronics America, UPD75P3216GT Datasheet - Page 47

• Manufacturer Part Number: UPD75P3216GT
• Manufacturer: Renesas Electronics America

Specifications of UPD75P3216GT

• Lead Free Status / Rohs Status: Supplier Unconfirmed

12. RECOMMENDED SOLDERING CONDITIONS
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Method
Remark For soldering methods and conditions other than those recommended above, contact an NEC
The µ PD75P3216 should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
(1) µ PD75P3216GT: 48-pin plastic shrink SOP (375 mil, 0.65 mm pitch)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(2) µ PD75P3216GT-A: 48-pin plastic shrink SOP (375 mil, 0.65 mm pitch)
Undefined
Remark Products with “-A” at the end of the part number are lead-free products.
Electronics sales representative.
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less,
Exposure limit: 7 days
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less,
Exposure limit: 7 days
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once
Preheating temperature: 120°C max. (package surface temperature)
Exposure limit: 7 days
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Table 12-1. Surface Mounting Type Soldering Conditions
Note
Note
Note
Data Sheet U10241EJ1V1DS
(after that, prebake at 125°C for 10 to 72 hours)
(after that, prebake at 125°C for 10 to 72 hours)
(after that, prebake at 125°C for 10 to 72 hours)
Soldering Conditions
µ PD75P3216
IR35-107-2
VP15-107-2
WS60-107-1
Condition Symbol
Recommended
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