RC28F256P30B85 Micron Technology Inc, RC28F256P30B85 Datasheet - Page 12

• Manufacturer Part Number: RC28F256P30B85
• Manufacturer: Micron Technology Inc

Specifications of RC28F256P30B85

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 85/17ns
• Interface Type: Parallel/Serial
• Boot Type: Bottom
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Program/erase Volt (typ): 1.7 to 2/8.5 to 9.5V
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 16M
• Supply Current: 28mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Not Compliant

Table 7:
Datasheet
12
Product Information
Package Height (64/128/256-Mbit)
Package Height (512-Mbit)
Ball Height
Package Body Thickness (64/128/256-
Mbit)
Package Body Thickness (512-Mbit)
Ball (Lead) Width
Package Body Width
Package Body Length
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D
Corner to Ball A1 Distance Along E
Notes:
1.
Daisy Chain Evaluation Unit information is at Numonyx™ Flash Memory Packaging Technology
http://developer.Numonyx.com/design/flash/packtech.
Easy BGA Package Dimensions
Symbol
[e]
A1
A2
A2
S1
S2
A
D
N
A
b
E
Y
12.900
0.250
0.330
9.900
1.400
2.900
Min
-
-
-
-
-
-
-
Millimeters
10.000
13.000
0.780
0.910
0.430
1.000
1.500
3.000
Nom
64
-
-
-
-
10.100
13.100
1.200
1.300
0.530
0.100
1.600
3.100
Max
-
-
-
-
-
0.0098
0.0130
0.3898
0.5079
0.0551
0.1142
Min
-
-
-
-
-
-
-
Inches
0.0307
0.0358
0.0169
0.3937
0.5118
0.0394
0.0591
0.1181
Nom
64
-
-
-
-
0.0472
0.0512
0.0209
0.3976
0.5157
0.0039
0.0630
0.1220
Max
-
-
-
-
-
August 2008
306666-12
Notes
P30