RC28F256P30B85 Micron Technology Inc, RC28F256P30B85 Datasheet - Page 3

• Manufacturer Part Number: RC28F256P30B85
• Manufacturer: Micron Technology Inc

Specifications of RC28F256P30B85

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 85/17ns
• Interface Type: Parallel/Serial
• Boot Type: Bottom
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Program/erase Volt (typ): 1.7 to 2/8.5 to 9.5V
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 16M
• Supply Current: 28mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Not Compliant

P30
Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Security Modes ........................................................................................................ 36
August 2008
306666-12
Functional Description ............................................................................................... 5
1.1
1.2
1.3
1.4
Package Information ................................................................................................. 9
2.1
2.2
2.3
Ballouts ................................................................................................................... 15
Signals .................................................................................................................... 18
4.1
Bus Operations ........................................................................................................ 21
5.1
5.2
5.3
5.4
5.5
Command Set .......................................................................................................... 23
6.1
6.2
Read Operation........................................................................................................ 26
7.1
7.2
7.3
7.4
Program Operation .................................................................................................. 28
8.1
8.2
8.3
8.4
8.5
8.6
8.7
Erase Operations ..................................................................................................... 34
9.1
9.2
9.3
9.4
10.1
Introduction ....................................................................................................... 5
Overview ........................................................................................................... 5
Virtual Chip Enable Description.............................................................................. 6
Memory Maps ..................................................................................................... 6
56-Lead TSOP..................................................................................................... 9
64-Ball Easy BGA Package .................................................................................. 10
QUAD+ SCSP Packages ...................................................................................... 12
Dual-Die Configurations ..................................................................................... 20
Reads .............................................................................................................. 21
Writes.............................................................................................................. 21
Output Disable.................................................................................................. 21
Standby ........................................................................................................... 22
Reset............................................................................................................... 22
Device Command Codes..................................................................................... 23
Device Command Bus Cycles .............................................................................. 24
Asynchronous Page-Mode Read ........................................................................... 26
Synchronous Burst-Mode Read............................................................................ 26
Read Device Identifier........................................................................................ 27
Read CFI.......................................................................................................... 27
Word Programming ........................................................................................... 28
Factory Word Programming ................................................................................ 29
Buffered Programming ....................................................................................... 29
Buffered Enhanced Factory Programming.............................................................. 30
8.4.1
8.4.2
8.4.3
8.4.4
Program Suspend .............................................................................................. 32
Program Resume............................................................................................... 32
Program Protection............................................................................................ 33
Block Erase ...................................................................................................... 34
Erase Suspend .................................................................................................. 34
Erase Resume................................................................................................... 35
Erase Protection ................................................................................................ 35
Block Locking.................................................................................................... 36
10.1.1 Lock Block............................................................................................. 36
10.1.2 Unlock Block.......................................................................................... 36
BEFP Requirements and Considerations ..................................................... 30
BEFP Setup Phase .................................................................................. 31
BEFP Program/Verify Phase ..................................................................... 31
BEFP Exit Phase ..................................................................................... 32
Datasheet
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