SC16C850IBS,157 NXP Semiconductors, SC16C850IBS,157 Datasheet - Page 2

• Manufacturer Part Number: SC16C850IBS,157
• Description: IC UART SGL W/FIFO 32HVQFN
• Manufacturer: NXP Semiconductors

Specifications of SC16C850IBS,157

• Features: Programmable
• Number Of Channels: 1, UART
• Fifo's: 128 Byte
• Protocol: RS485
• Voltage - Supply: 2.5 V ~ 3.3 V
• With Auto Flow Control: Yes
• With Irda Encoder/decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Transmitter And Receiver Fifo Counter: Yes
• Data Rate: 5Mbps
• Mounting: Surface Mount
• Pin Count: 32
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
3. Ordering information
Table 1.
[1]
SC16C850
Product data sheet
Type number
SC16C850IBS
SC16C850IBS/Q900
SC16C850IET
SC16C850IBS/Q900 is AEC-Q100 compliant. Contact [e-mail] for PPAP.
Ordering information
Package
Name
HVQFN32
HVQFN32
TFBGA36
Programmable Xon/Xoff characters
Software selectable baud rate generator
Support IrDA version 1.0 (up to 115.2 kbit/s)
Standard modem interface or infrared IrDA encoder/decoder interface
Enhanced Sleep mode and low power feature
Modem control functions (CTS, RTS, DSR, DTR, RI, CD)
Independent transmitter and receiver enable/disable
Pb-free, RoHS compliant package offered
Description
plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 × 5 × 0.85 mm
plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 × 5 × 0.85 mm
plastic thin fine-pitch ball grid array package; 36 balls;
body 3.5 × 3.5 × 0.8 mm
All information provided in this document is subject to legal disclaimers.
2.5 to 3.3 V UART with 128-byte FIFOs and IrDA encoder/decoder
Rev. 2 — 11 November 2010
SC16C850
© NXP B.V. 2010. All rights reserved.
Version
SOT617-1
SOT617-1
SOT912-1
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