SC16C850IBS,157 NXP Semiconductors, SC16C850IBS,157 Datasheet - Page 49

• Manufacturer Part Number: SC16C850IBS,157
• Description: IC UART SGL W/FIFO 32HVQFN
• Manufacturer: NXP Semiconductors

Specifications of SC16C850IBS,157

• Features: Programmable
• Number Of Channels: 1, UART
• Fifo's: 128 Byte
• Protocol: RS485
• Voltage - Supply: 2.5 V ~ 3.3 V
• With Auto Flow Control: Yes
• With Irda Encoder/decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Transmitter And Receiver Fifo Counter: Yes
• Data Rate: 5Mbps
• Mounting: Surface Mount
• Pin Count: 32
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
12. Soldering of SMD packages
SC16C850
Product data sheet
12.1 Introduction to soldering
12.2 Wave and reflow soldering
12.3 Wave soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Key characteristics in wave soldering are:
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Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
All information provided in this document is subject to legal disclaimers.
2.5 to 3.3 V UART with 128-byte FIFOs and IrDA encoder/decoder
Rev. 2 — 11 November 2010
SC16C850
© NXP B.V. 2010. All rights reserved.
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