LP62S16128BV-55LLT AMIC Technology Corporation, LP62S16128BV-55LLT Datasheet

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LP62S16128BV-55LLT

Manufacturer Part Number
LP62S16128BV-55LLT
Description
Manufacturer
AMIC Technology Corporation
Datasheet

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LP62S16128BV-55LLT
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LP62S16128BV-55LLTF
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Document Title
Revision History
(June, 2004, Version 1.3)
128K X 16 BIT LOW VOLTAGE CMOS SRAM
Rev. No.
1.1
1.2
1.3
History
Add product family
Change I
Modify 48LD CSP outline dimensions
Add 44L Pb-free TSOP package type
Add 48L Pb-free CSP package type
CC2
from 15mA to 8mA
128K X 16 BIT LOW VOLTAGE CMOS SRAM
1
LP62S16128B-T Series
Issue Date
May 26, 2003
March 23, 2004
June 18, 2004
AMIC Technology, Corp.
Remark
Final

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LP62S16128BV-55LLT Summary of contents

Page 1

Document Title 128K X 16 BIT LOW VOLTAGE CMOS SRAM Revision History Rev. No. History 1.1 Add product family Change I from 15mA to 8mA CC2 1.2 Modify 48LD CSP outline dimensions Add 44L Pb-free TSOP package type 1.3 Add ...

Page 2

Features Operating voltage: 2.7V to 3.6V Access times: 55/70 ns (max.) Current: Very low power version: Operating: 55ns 40mA (max.) 70ns 35mA (max.) Standby: 10µA (max.) Full static operation, no clock or refreshing required All inputs and outputs are directly ...

Page 3

Block Diagram A0 A15 A16 I CONTROL HB CIRCUIT OE WE Pin Descriptions -- TSOP Pin No. Symbol – 22 A16 24 – 27 ...

Page 4

Pin Description - CSP Symbol Description A0 - A16 Address Inputs Chip Enable CE I/O - I/O Data Input/Output 1 16 Write Enable Input WE Byte Enable Input LB (I Recommended DC Operating Conditions = ...

Page 5

Absolute Maximum Ratings* VCC to GND ............................................... -0.5V to +4.6V IN, IN/OUT Volt to GND.....................-0.5V to VCC + 0.5V Operating Temperature, Topr .................... -25 ° +85 ° C Storage Temperature, Tstg...................... -55 ° +125 ° C ...

Page 6

Truth Table Note ° 1.0MHz) Capacitance (T A ...

Page 7

C to +85 ° C, VCC = 2.7V to 3.6V) AC Characteristics (T A Symbol Parameter Read Cycle t Read Cycle Time RC t Address Access Time AA t Chip Enable Access Time ACE t Byte Enable ...

Page 8

Timing Waveforms ( Read Cycle 1 Address D OUT ( Read Cycle 2 Address CE HB OUT Notes high for Read Cycle. 2. Device is continuously enabled ...

Page 9

Timing Waveforms (continued) Write Cycle 1 (Write Enable Controlled) Address CE HB DATA IN DATA OUT Write Cycle 2 (Chip Enable Controlled) Address CE HB DATA IN DATA OUT (June, 2004, Version 1. ...

Page 10

Timing Waveforms (continued) Write Cycle 3 (Byte Enable Controlled) Address CE HB DATA IN DATA OUT Notes measured from the address valid to the beginning of Write Write occurs during the overlap ...

Page 11

AC Test Conditions Input Pulse Levels Input Rise And Fall Time Input and Output Timing Reference Levels Output Load Including scope and jig. Figure 1. Output Load Data Retention Characteristics Symbol Parameter V VCC for Data Retention ...

Page 12

... Low VCC Data Retention Waveform VCC 2.7V t CDR Ordering Information Part No. Access Time (ns) LP62S16128BV-55LLT LP62S16128BV-55LLTF LP62S16128BU-55LLT LP62S16128BU-55LLTF LP62S16128BV-70LLT LP62S16128BV-70LLTF LP62S16128BU-70LLT LP62S16128BU-70LLTF (June, 2004, Version 1.3) DATA RETENTION MODE ≥ ≥ 0.2V DR Operating Current Max. (mA LP62S16128B-T Series 2 ...

Page 13

Package Information TSOP 44L TYPE II Outline Dimensions Notes: 1. Dimension D&E do not include interlead flash. 2. Dimension B does not include dambar protrusion/intrusion. 3. Dimension S includes end flash. (June, 2004, Version 1.3) 23 ...

Page 14

Package Information 48LD CSP ( mm) Outline Dimensions (48TFBGA) Ball*A1 CORNER SEATING PLANE Note: 1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS ARE DIFFERENT FROM JEDEC SPEC ...

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