A62S6316V-55SI AMIC Technology Corporation, A62S6316V-55SI Datasheet

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A62S6316V-55SI

Manufacturer Part Number
A62S6316V-55SI
Description
Manufacturer
AMIC Technology Corporation
Datasheet

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Document Title
Revision History
(August, 2004, Version 1.1)
64K X 16 BIT LOW VOLTAGE CMOS SRAM
Rev. No.
0.0
0.1
0.2
0.3
0.4
0.5
1.0
1.1
History
Initial issue
Change access times from 70/100 ns to 55/70 ns(max.)
Change dynamic operating current from 80/70mA to 40mA
Modify TSOP 44L (Type II) package outline drawing
Modify truth table
Change dynamic operating current from 40mA to 50mA(max.)
Modify TSOP 44L (Type II) package outline drawing and
Dimensions
Add mini BGA package outline dimensions symbol E
max.
Final version release
Add Pb-Free package type
64K X 16 BIT LOW VOLTAGE CMOS SRAM
2
min. and
Issue Date
October 8, 1998
February 12, 1999
June 9, 1999
June 21, 1999
November 9, 1999
August 12, 2002
July 11, 2003
August 9, 2004
A62S6316 Series
AMIC Technology, Corp.
Remark
Preliminary
Final

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A62S6316V-55SI Summary of contents

Page 1

Document Title 64K X 16 BIT LOW VOLTAGE CMOS SRAM Revision History Rev. No. History 0.0 Initial issue 0.1 Change access times from 70/100 ns to 55/70 ns(max.) Change dynamic operating current from 80/70mA to 40mA Modify TSOP 44L (Type ...

Page 2

Features Operating voltage: 2.7V to 3.3V Access times: 55/70 ns (max.) Current: A62S6316-S series: Operating: 50mA (max.) Standby: A62S6316-SI series: Operating: 50mA (max.) Standby: Extended operating temperature range : -25°C to 85°C for -SI series Full static operation, no clock ...

Page 3

Block Diagram A0 DECODER A14 A15 I/O 0 INPUT DATA CIRCUIT I CONTROL HB CIRCUIT OE WE (August, 2004, Version 1.1) VCC GND 512 X 2048 MEMORY ARRAY COLUMN I/O INPUT DATA CIRCUIT AMIC Technology, Corp. 1 ...

Page 4

Pin Description - TSOP Pin No. Symbol 21 A15 24 - 27, 10 16, I ...

Page 5

Absolute Maximum Ratings* VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to +4.6V IN, IN/OUT Volt to GND . . . . . ...

Page 6

Truth Table Note ° 1.0MHz) Capacitance (T A Symbol Parameter C * ...

Page 7

C to +70 ° -25 ° ° C, VCC = 2.7V to 3.3V) AC Characteristics (T A Symbol Parameter Read Cycle t Read Cycle Time RC t Address Access Time AA t ...

Page 8

Timing Waveforms ( Read Cycle 1 Address D OUT ( Read Cycle 2 Address CE HB OUT Notes high for Read Cycle. 2. Device is continuously enabled ...

Page 9

Timing Waveforms (continued) Write Cycle 1 (Write Enable Controlled) Address CE HB DATA IN DATA OUT Write Cycle 2 (Chip Enable Controlled) Address CE HB DATA IN DATA OUT (August, 2004, Version 1. ...

Page 10

Timing Waveforms (continued) Write Cycle 3 (Byte Enable Controlled) Address CE HB DATA IN DATA OUT Notes measured from the address valid to the beginning of Write Write occurs during the overlap ...

Page 11

AC Test Conditions Input Pulse Levels Input Rise And Fall Time Input and Output Timing Reference Levels Output Load Including scope and jig. Figure 1. Output Load Data Retention Characteristics Symbol Parameter V VCC for Data Retention ...

Page 12

... Low VCC Data Retention Waveform VCC 2.7V t CDR Ordering Information Part No. Access Time (ns) A62S6316V-55S A62S6316V-55SF A62S6316V-55SI A62S6316V-55SIF A62S6316G-55S A62S6316G-55SF A62S6316G-55SI A62S6316G-55SIF A62S6316V-70S A62S6316V-70SF A62S6316V-70SI A62S6316V-70SIF A62S6316G-70S A62S6316G-70SF A62S6316G-70SI A62S6316G-70SIF (August, 2004, Version 1.1) DATA RETENTION MODE ≥ ≥ 0.2V DR Operating Current Max ...

Page 13

Package Information TSOP 44L (Type II) Outline Dimensions Symbol Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E 3. Dimension ZD includes end flash. (August, 2004, Version 1. ...

Page 14

Package Information Mini BGA 6X8 (48 BALLS) Outline Dimensions Bottom View (August, 2004, Version 1.1) Pin A1 Index Pin A1 Index Diameter D Solder ...

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