ADP5065 Analog Devices, ADP5065 Datasheet - Page 7

• Manufacturer Part Number: ADP5065
• Description: Fast Charge Battery Management with Power Path and USB Compatibility
• Manufacturer: Analog Devices

Specifications of ADP5065

• Product Description: Fast Charge Battery Management with Power Path and USB Compatibility
• Switching/linear: Switching
• Cell Type: Li-Ion
• Final Voltage Options: 4.2
• Accuracy Over Temp (%): 0.3%
• Temp Range: -40 to +125°C
• Package: WLCSP-20
• Active For Param Search: Yes

Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
VIN1, VIN2 to PGND1, PGND2
All Other Pins to AGND
Continuous Drain Current, Battery Supple-
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
mentary Mode, from ISO_Bx to ISO_Sx
T
T
J
J
≤ 85°C
= 125°C
Rating
−0.5 V to +12 V
−0.3 V to +6 V
2.2 A
1.1 A
−65°C to +150°C
−40°C to +125°C
JEDEC J-STD-020
Rev. A | Page 7 of 40
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
20-Lead WLCSP
1
Maximum Power Dissipation
The maximum safe power dissipation in the
is limited by the associated rise in junction temperature (T
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit may change the stresses that
the package exerts on the die, permanently shifting the para-
metric performance of the ADP5065. Exceeding a junction
temperature of 175°C for an extended period of time can result
in changes in the silicon devices that potentially cause failure.
ESD CAUTION
JA
5 × 4 array, 0.5 mm pitch (2.75 mm × 2.08 mm); based on a JEDEC, 2S2P,
4-layer board with 0 m/sec airflow.
is specified for the worst-case conditions, that is, a device
1
θ
46.8
JA
θ
0.7
JC
ADP5065
θ
9.2
JB
ADP5065
package
Unit
°C/W
J
) on