BSS138PW NXP Semiconductors, BSS138PW Datasheet - Page 12
BSS138PW
Manufacturer Part Number
BSS138PW
Description
N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
Manufacturer
NXP Semiconductors
Datasheet
1.BSS138PW.pdf
(16 pages)
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Part Number:
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BSS138PW / BSS138P
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Part Number:
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NXP Semiconductors
10. Soldering
BSS138PW
Product data sheet
Fig 19. Reflow soldering footprint SOT323 (SC-70)
Fig 20. Wave soldering footprint SOT323 (SC-70)
3.65 2.1
2.35
(3×)
0.6
All information provided in this document is subject to legal disclaimers.
1.425
(3×)
0.55
(3×)
Rev. 1 — 2 November 2010
3
2.65
1.85
2.575
4.6
1.325
2
1
(3×)
0.5
1.3
60 V, 320 mA N-channel Trench MOSFET
(2×)
09
1.8
Dimensions in mm
BSS138PW
direction during soldering
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
preferred transport
solder lands
solder resist
solder paste
occupied area
sot323_fr
solder lands
solder resist
occupied area
sot323_fw
12 of 16
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