STM32F103VF STMicroelectronics, STM32F103VF Datasheet - Page 14

• Manufacturer Part Number: STM32F103VF
• Description: Mainstream Performance line, ARM Cortex-M3 MCU with 768 Kbytes Flash, 72MHz CPU, motor control, USB and CAN
• Manufacturer: STMicroelectronics

Specifications of STM32F103VF

• Conversion Range: 0 to 3.6 V
• Supported Peripherals: timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs
• Systick Timer: a 24-bit downcounter

Description
2.2
Table 3.
1. For orderable part numbers that do not show the A internal code after the temperature range code (6 or 7), the reference
2. 64 KB RAM for 256 KB Flash are available on devices delivered in CSP packages only.
3. Ports F and G are not available in devices delivered in 100-pin packages.
4. Ports F and G are not available in devices delivered in 100-pin packages.
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Pinout
144
100
64
48
36
datasheet for electrical characteristics is that of the STM32F103x8/B medium-density devices.
2 × USARTs
2 × 16-bit timers
1 × SPI, 1 × I
USB, CAN,
1 × PWM timer
2 × ADCs
16 KB
Flash
6 KB
RAM
Low-density
Full compatibility throughout the family
The STM32F103xx is a complete family whose members are fully pin-to-pin, software and
feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are
identified as low-density devices, the STM32F103x8 and STM32F103xB are referred to as
medium-density devices, the STM32F103xC, STM32F103xD and STM32F103xE are
referred to as high-density devices and the STM32F103xF and STM32F103xG are called
XL-density devices.
Low-density, high-density and XL-density devices are an extension of the STM32F103x8/B
medium-density devices, they are specified in the STM32F103x4/6, STM32F103xC/D/E and
STM32F103xF/G datasheets, respectively. Low-density devices feature lower Flash
memory and RAM capacities, less timers and peripherals. High-density devices have higher
Flash memory and RAM capacities, and additional peripherals like SDIO, FSMC, I
DAC. XL-density devices bring even more Flash and RAM memory, and extra features,
namely an MPU, a greater number of timers and a dual bank Flash structure while
remaining fully compatible with the other members of the family.
The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD, STM32F103xE,
STM32F103xF and STM32F103xG are a drop-in replacement for the STM32F103x8/B
devices, allowing the user to try different memory densities and providing a greater degree
of freedom during the development cycle.
Moreover, the STM32F103xx performance line family is fully compatible with all existing
STM32F101xx access line and STM32F102xx USB access line devices.
STM32F103xx family
devices
Flash
32 KB
10 KB
RAM
2
C,
(1)
3 × USARTs
3 × 16-bit timers
2 × SPIs, 2 × I
USB, CAN,
1 × PWM timer
2 × ADCs
64 KB
20 KB
Flash
Medium-density
RAM
devices
128 KB
20 KB
Flash
RAM
2
Cs,
Doc ID 16554 Rev 3
5 × USARTs
4 × 16-bit timers,
2 × basic timers
3 × SPIs, 2 × I
USB, CAN, 2 × PWM timers
3 × ADCs, 2 × DACs,
1 × SDIO
FSMC (100- and 144-pin
packages
64 KB
256 KB
Flash
48 or
RAM
High-density devices
(2)
(3)
384 KB
)
64 KB
Flash
RAM
2
Ss, 2 × I2Cs
512 KB
64 KB
Flash
RAM
STM32F103xF, STM32F103xG
5 × USARTs
10 × 16-bit timers,
2 × basic timers
3 × SPIs, 2 × I
USB, CAN, 2 × PWM timers
3 × ADCs, 2 × DACs, 1 × SDIO,
Cortex-M3 with MPU
FSMC (100- and 144-pin
packages
memory
768 KB Flash
96 KB RAM
XL-density devices
(4)
), dual bank Flash
2
Ss, 2 × I2Cs
96 KB RAM
1 MB Flash
2
S and