NC7SZ125L6X Fairchild Semiconductor, NC7SZ125L6X Datasheet

IC BUFFER UHS 3ST NONINV 6MCRPAK

NC7SZ125L6X

Manufacturer Part Number
NC7SZ125L6X
Description
IC BUFFER UHS 3ST NONINV 6MCRPAK
Manufacturer
Fairchild Semiconductor
Series
7SZr
Datasheet

Specifications of NC7SZ125L6X

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
1
Current - Output High, Low
32mA, 32mA
Voltage - Supply
1.65 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
6-MicroPak™
Logic Family
NC7SZ
Number Of Channels Per Chip
Single
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.65 V
Maximum Operating Temperature
85 C
Mounting Style
SMD/SMT
High Level Output Current
- 32 mA
Input Bias Current (max)
2 uA
Low Level Output Current
32 mA
Maximum Power Dissipation
200 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
1
Output Type
3-State
Propagation Delay Time
5.7 ns @ 3.3 V or 5 ns @ 5 V
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
1.65V To 5.5V
Logic Case Style
MicroPak
No. Of Pins
6
Operating Temperature Range
-40°C To +85°C
Propagation Delay
2.6ns
Rohs Compliant
Yes
Leaded Process Compatible
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NC7SZ125L6X
NC7SZ125L6XTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NC7SZ125L6X
Manufacturer:
JRC
Quantity:
12 000
Part Number:
NC7SZ125L6X
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Company:
Part Number:
NC7SZ125L6X
Quantity:
4 333
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Leng, HooiChin
E-mail: HooiChin.Leng@notes.fairchildsemi.com
Phone: 604-8502370
Implementation of change:
Expected 1st Device Shipment Date: 2009/01/02
Earliest Year/Work Week of Changed Product: 0901
Change Type Description: Die Attach Material, Mold Compound
Description of Change (From): Fairchild's Micropak packages currently assembled at
Hana-Ayutthaya using non-green mold compound and substrate materials.
Description of Change (To): Green, Halogen Free RoHS compliant packages. The Micropak
packages assembled at Hana-Ayutthaya will be Green with the changes to mold compound and
the substrate. (Note: Two mold compounds have been qualified to support the change to green
materials and based on performance, can be interchanged.) Also refer to the tables below for
comparisons of this change.
Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is
dedicated to being a good corporate citizen. The reference material changes have been made to
provide a Full Green (Halogen Free Flame Retardant) package. For additional details on the
corporate wide green initiative please visit our Web site at:
http://www.fairchildsemi.com/company/green/index.html. Package outline drawings of the
Micropak packages will remain unchanged. Green products will be fully compliant to all
published datasheet specifications and will be interchangeable with current non-green product.
Quality and Reliability will remain at the highest standards already demonstrated with Fairchild
existing products.
Qual/REL Plan Numbers : Q20070331
Qualification :
Attached are the Reliability Test results to qualify the Green conversion of the Micropak
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: Leng, HooiChin
E-mail: HooiChin.Leng@notes.fairchildsemi.com
Phone: 604-8502370
Date Issued On : 2008/10/03
Date Created : 2008/08/05
PCN# : Q3083202
Pg. 1

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NC7SZ125L6X Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

... Q20070331BAFLAMB NC7SZ125L6X Q20070331CAFLAMB FHP3131IL6X Q20070331DAFLAMB NC7SZ74L8X Test: (High Temperature Storage Life) | Conditions: 150C | Standard: JESD22-A103 Lot Device Q20070331AAHTSLB FSA2257L10X Q20070331BAHTSLB NC7SZ125L6X Q20070331CAHTSLB FHP3131IL6X Q20070331DAHTSLB NC7SZ74L8X Test: (Highly Accelerated Stress Test) | Conditions: 85%RH, 110C Standard: JESD22-A110 Lot Device Q20070331AAHAST2B FSA2257L10X Setpoint Result ...

Page 3

... FHP3131IL6X Q20070331CASOLDCBB Q20070331DASOLDCAB NC7SZ74L8X Q20070331DASOLDCBB Test: (Static Op Life) | Conditions: 150C Standard: JESD22-A108 Lot Device Q20070331AASOPL1B FSA2257L10X Q20070331BASOPL1B NC7SZ125L6X Q20070331CASOPL1B FHP3131IL6X Q20070331DASOPL1B NC7SZ74L8X Test: (Temperature Cycle) | Conditions: | Standard: JESD22-A104 Lot Device Q20070331CATMCL1B FHP3131IL6X Test: (Temperature Cycle) | Conditions: -65C, 150C | Standard: JESD22-A104 Lot ...

Page 4

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Page 5

NC7SZ58L6X_F087 NC7SZ74L8X_F087 NC7WB66L8X NC7WP02L8X NC7WP125L8X NC7WP32L8X NC7WV07L6X_F065 NC7WV17L6X NC7WZ02L8X NC7WZ07L6X NC7WZ08L8X_F087 NC7WZ126L8X NC7WZ14L6X_F065 NC7WZ16L6X_F065 NC7WZ17L6X_F065 NC7WZ241L8X NC7WZ86L8X NC7WZU04L6X_F065 NC7SZ66L6X NC7SZ86L6X NC7WB66L8X_F087 NC7WP02L8X_F087 NC7WP14L6X NC7WV04L6X NC7WV14L6X NC7WZ00L8X NC7WZ04L6X NC7WZ07L6X_F065 NC7WZ125L8X NC7WZ132L8X NC7WZ14L6X_F087 NC7WZ16L6X_F087 NC7WZ17L6X_F087 NC7WZ32L8X NC7WZ86L8X_F087 NC7SZ74L8X NC7SZU04L6X NC7WP00L8X NC7WP08L8X NC7WP240L8X ...

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